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ZHCSLD4K August 1999 – September 2023 TL331 , TL331B , TL391B

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.7 Thermal Information

THERMAL METRIC⁽¹⁾		TL331, TL331K	TL331B, TL391B	UNIT
		DBV (SOT-23)	DBV (SOT-23)
		5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	218.3	211.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	87.3	133.6	°C/W
R_θJB	Junction-to-board thermal resistance	44.9	79.9	°C/W
ψ_JT	Junction-to-top characterization parameter	4.3	56.4	°C/W
ψ_JB	Junction-to-board characterization parameter	44.1	79.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.