ZHCSK06F March 2005 – July 2019 TL431-Q1 , TL432-Q1
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 修订历史记录
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12器件和文档支持
- 13机械、封装和可订购信息
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
- DBZ|3
- DBV|5
散热焊盘机械数据 (封装 | 引脚)
订购信息
6.8 Typical Characteristics
Data is for devices having the indicated value of VREF at IKA = 10 mA, TA = 25°C.
Figure 1. Reference Voltage vs Free-air Temperature 
Figure 3. Cathode Current vs Cathode Voltage 
Figure 5. OFF-State Cathode Current vs
Free-air Temperature
Figure 7. Equivalent Input Noise Voltage vs Frequency 
Figure 9. Small-Signal Voltage Amplification vs Frequency 
The areas under the curves represent conditions that may cause the device to oscillate. For curves B, C, and D, R2 and VREF were adjusted to establish the initial VKA and IKA conditions with CL = 0. VBATT and CL then were adjusted to determine the ranges of stability (see Figure 18 and Figure 19 for test circuits).
Figure 13. Stability Boundary Conditions for All TL43x, SOT-23, SC-70, and Q-TEMP Devices 
Figure 4. Cathode Current vs Cathode Voltage 
Figure 6. Ratio of Delta Reference Voltage to Delta Cathode Voltage vs Free-air Temperature 
Figure 8. Equivalent Input Noise Voltage Over a 10-s Period 
Figure 10. Reference Impedance vs Frequency 
The areas under the curves represent conditions that may cause the device to oscillate. For curves B, C, and D, R2 and VREF were adjusted to establish the initial VKA and IKA conditions with CL = 0. VBATT and CL then were adjusted to determine the ranges of stability (see Figure 18 and Figure 19 for test circuits).
Figure 12. Stability Boundary Conditions for All TL43x Devices (Except for SOT23-3, SC-70,
and Q-TEMP Devices)