米6体育平台手机版

ZHCSJJ4A march 2019 – august 2021 TL7700-SEP

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TL7700-SEP	UNIT
		PW (TSSOP)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	172.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	56.6	°C/W
R_θJB	Junction-to-board thermal resistance	101.2	°C/W
ψ_JT	Junction-to-top characterization parameter	5.2	°C/W
ψ_JB	Junction-to-board characterization parameter	99.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.