ZHCSH32 November   2017 TLA2021 , TLA2022 , TLA2024

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      系统监控应用示例
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Analog Inputs
      3. 8.3.3 Full-Scale Range (FSR) and LSB Size
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Oscillator
      6. 8.3.6 Output Data Rate and Conversion Time
    4. 8.4 Device Functional Modes
      1. 8.4.1 Reset and Power-Up
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Single-Shot Conversion Mode
        2. 8.4.2.2 Continuous-Conversion Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Address Selection
        2. 8.5.1.2 I2C Interface Speed
        3. 8.5.1.3 Serial Clock (SCL) and Serial Data (SDA)
        4. 8.5.1.4 I2C Data Transfer Protocol
        5. 8.5.1.5 Timeout
        6. 8.5.1.6 I2C General-Call (Software Reset)
      2. 8.5.2 Reading and Writing Register Data
        1. 8.5.2.1 Reading Conversion Data or the Configuration Register
        2. 8.5.2.2 Writing the Configuration Register
      3. 8.5.3 Data Format
  9. 9 Register Maps
    1. 9.1 Conversion Data Register (RP = 00h) [reset = 0000h]
      1. Table 6. Conversion Data Register Field Descriptions
    2. 9.2 Configuration Register (RP = 01h) [reset = 8583h]
      1. Table 7. Configuration Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Basic Interface Connections
      2. 10.1.2 Connecting Multiple Devices
      3. 10.1.3 Single-Ended Signal Measurements
      4. 10.1.4 Analog Input Filtering
      5. 10.1.5 Duty Cycling To Reduce Power Consumption
      6. 10.1.6 I2C Communication Sequence Example
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
VDD to GND 2 5.5 V
ANALOG INPUTS(1)
FSR Full-scale input voltage range(2)
(VIN = VAINP – VAINN)		 ±0.256 ±6.144 V
V(AINx) Absolute input voltage GND VDD V
DIGITAL INPUTS
Digital input voltage GND 5.5 V
TEMPERATURE
TA Operating ambient temperature –40 85 °C
(1) AINP and AINN denote the selected positive and negative inputs. On the TLA2024, AINx denotes one of the four available analog inputs.
(2) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3 V or 5.5 V (whichever is smaller) must be applied to this device. See the Full-Scale Range (FSR) and LSB Size section more information.
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