ZHCSP39G February 2003 – August 2022 TLC2272-Q1 , TLC2272A-Q1 , TLC2274-Q1 , TLC2274A-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TLC2272-Q1, TLC2272A-Q1 | TLC2274-Q1, TLC2274A-Q1 | UNIT | |||
|---|---|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | D (SOIC) | PW (TSSOP) | |||
| 8 PINS | 8 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 115.6 | 175.8 | 83.8 | 111.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.8 | 58.8 | 43.2 | 41.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 55.9 | 104.3 | 38.4 | 54.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 14.3 | 5.9 | 9.4 | 3.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 55.4 | 102.3 | 38.1 | 53.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | °C/W |