SLDS157E February   2008  – December 2014 TLC59116

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection
      2. 9.3.2 Overtemperature Detection and Shutdown
      3. 9.3.3 Power-On Reset (POR)
      4. 9.3.4 External Reset
      5. 9.3.5 Software Reset
      6. 9.3.6 Individual Brightness Control With Group Dimming/Blinking
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active
      2. 9.4.2 Standby
    5. 9.5 Register Maps
      1. 9.5.1  Mode Register 1 (MODE1)"SLEEP" to "OSC" in Mode Register 1 (MODE1) Table.
      2. 9.5.2  Mode Register 2 (MODE2)
      3. 9.5.3  Brightness Control Registers 0 to 15 (PWM0 to PWM15)
      4. 9.5.4  Group Duty Cycle Control Register (GRPPWM)
      5. 9.5.5  Group Frequency Register (GRPFREQ)
      6. 9.5.6  LED Driver Output State Registers 0 to 3 (LEDOUT0 to LEDOUT3)
      7. 9.5.7  I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
      8. 9.5.8  LED All Call I2C Bus Address Register (ALLCALLADR)
      9. 9.5.9  Output Gain Control Register (IREF)
      10. 9.5.10 Error Flags Registers (EFLAG1, EFLAG2)
      11. 9.5.11 Control Register
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Device Address
      2. 10.1.2 Regular I2C Bus Slave Address
      3. 10.1.3 LED All Call I2C Bus Address
      4. 10.1.4 LED Sub Call I2C Bus Address
      5. 10.1.5 Software Reset I2C Bus Address
      6. 10.1.6 Characteristics of the I2C Bus
        1. 10.1.6.1 Bit Transfer
        2. 10.1.6.2 Start and Stop Conditions
        3. 10.1.6.3 Acknowledge
      7. 10.1.7 System Configuration
      8. 10.1.8 Constant Current Output
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Adjusting Output Current
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (June 2011) to E Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from C Revision (June 2010) to D Revision

  • Added Output Current vs Output Voltage Figure.Go
  • Changed "SLEEP" to "OSC" in Mode Register 1 (MODE1) Table.Go
  • Added Bits 6 and 4 to the Mode Register 2 Bit Description Table.Go
  • Changed VALUES column in the Mode Register 2 Bit Description Table.Go
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