SLVS515D December 2004 – November 2015 TLC5940
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input voltage(2) | VCC | –0.3 | 6 | V |
| V(BLANK), V(DCPRG), V(SCLK), V(XLAT), V(SIN), V(GSCLK), V(IREF) | –0.3 | VCC +0.3 | V | |
| Output voltage | V(SOUT), V(XERR) | –0.3 | VCC +0.3 | V |
| V(OUT0) to V(OUT15) | –0.3 | 18 | V | |
| Output current (dc) | 130 | mA | ||
| EEPROM program range | V(VPRG) | –0.3 | 24 | V |
| EEPROM write cycles | 50 | — | ||
| Storage temperature, Tstg | –55 | 150 | °C | |
(1) Stresses beyond those listed under may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| DC CHARACTERISTICS | ||||||
| VCC | Supply Voltage | 3 | 5.5 | V | ||
| V O | Voltage applied to output (OUT0–OUT15) | 17 | V | |||
| VIH | High-level input voltage | 0.8 VCC | VCC | V | ||
| VIL | Low-level input voltage | GND | 0.2 VCC | V | ||
| IOH | High-level output current | VCC = 5 V at SOUT | –1 | mA | ||
| IOL | Low-level output current | VCC = 5 V at SOUT, XERR | 1 | mA | ||
| IOLC | Constant output current | OUT0 to OUT15, VCC < 3.6 V | 60 | mA | ||
| OUT0 to OUT15, VCC > 3.6 V | 120 | mA | ||||
| V(VPRG) | EEPROM program voltage | 20 | 22 | 23 | V | |
| TA | Operating free-air temperature range | -40 | 85 | °C | ||
| AC CHARACTERISTICS
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted) |
||||||
| f(SCLK) | Data shift clock frequency | SCLK | 30 | MHz | ||
| f(GSCLK) | Grayscale clock frequency | GSCLK | 30 | MHz | ||
| twh0/twl0 | SCLK pulse duration | SCLK = H/L (see Figure 11) | 16 | ns | ||
| twh1/twl1 | GSCLK pulse duration | GSCLK = H/L (see Figure 11) | 16 | ns | ||
| twh2 | XLAT pulse duration | XLAT = H (see Figure 11) | 20 | ns | ||
| twh3 | BLANK pulse duration | BLANK = H (see Figure 11) | 20 | ns | ||
| tsu0 | Setup time | SIN to SCLK ↑(1) (see Figure 11) | 5 | ns | ||
| tsu1 | SCLK ↓ to XLAT ↑ (see Figure 11) | 10 | ns | |||
| tsu2 | VPRG ↑ ↓ to SCLK ↑ (see Figure 11) | 10 | ns | |||
| tsu3 | VPRG ↑ ↓XLAT ↑ (see Figure 11) | 10 | ns | |||
| tsu4 | BLANK ↓ to GSCLK ↑ (see Figure 11) | 10 | ns | |||
| tsu5 | XLAT ↑ to GSCLK ↑ (see Figure 11) | 30 | ns | |||
| tsu6 | VPRG ↑ to DCPRG ↑ (see Figure 16) | 1 | ms | |||
| th0 | Hold Time | SCLK ↑ to SIN (see Figure 11) | 3 | ns | ||
| th1 | XLAT ↓ to SCLK ↑ (see Figure 11) | 10 | ns | |||
| th2 | SCLK ↑ to VPRG ↑ ↓ (see Figure 11) | 10 | ns | |||
| th3 | XLAT ↓ to VPRG ↑ ↓ (see Figure 11) | 10 | ns | |||
| th4 | GSCLK ↑ to BLANK ↑ (see Figure 11) | 10 | ns | |||
| th5 | DCPRG ↓ to VPRG ↓ (see Figure 11) | 1 | ms | |||
| tprog | Programming time for EEPROM (see Figure 16) | 20 | ms | |||
(1) ↑ and ↓ indicates a rising edge, and a falling edge respectively.
6.4 Thermal Information
| THERMAL METRIC(1) | TLC5940 | UNIT | ||
|---|---|---|---|---|
| PWP (HTSSOP) | RHB (VQFN) | |||
| 28 PINS | 32 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 36.7 | 34.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 18.9 | 36.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15.9 | 8.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.6 | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 15.8 | 8.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.3 | 1.6 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VOH | High-level output voltage | IOH = -1 mA, SOUT | VCC –0.5 | V | ||
| VOL | Low-level output voltage | IOL = 1 mA, SOUT | 0.5 | V | ||
| II | Input current | VI = VCC or GND; BLANK, DCPRG, GSCLK, SCLK, SIN, XLAT | –1 | 1 | μA | |
| VI = GND; VPRG | –1 | 1 | ||||
| VI = VCC; VPRG | 50 | |||||
| VI = 22 V; VPRG; DCPRG = VCC | 4 | 10 | mA | |||
| ICC | Supply current | No data transfer, all output OFF, VO = 1 V, R(IREF) = 10 kΩ |
0.9 | 6 | mA | |
| No data transfer, all output OFF, VO = 1 V, R(IREF) = 1.3 kΩ |
5.2 | 12 | ||||
| Data transfer 30MHz, all output ON, VO = 1 V, R(IREF) = 1.3 kΩ |
16 | 25 | ||||
| Data transfer 30MHz, all output ON, VO = 1 V, R(IREF) = 640 Ω |
30 | 60 | ||||
| IO(LC) | Constant sink current (see Figure 10) | All output ON, VO = 1 V, R(IREF) = 640 Ω | 54 | 61 | 69 | mA |
| Ilkg | Leakage output current | All output OFF, VO = 15 V, R(IREF) = 640 Ω, OUT0 to OUT15 |
0.1 | μA | ||
| ΔIO(LC0) | Constant sink current error (see Figure 10) | All output ON, VO = 1 V, R(IREF) = 640 Ω, OUT0 to OUT15, –20°C to 85°C |
±1% | ±4% | ||
| All output ON, VO = 1V, R(IREF) = 640 Ω, OUT0 to OUT15(1) |
±1% | ±8% | ||||
| All output ON, VO = 1V, R(IREF) = 320 Ω, OUT0 to OUT15, –20°C to 85°C |
±1% | ±6% | ||||
| All output ON, VO = 1V, R(IREF) = 320 Ω, VCC = 4.5 V to 5.5 V, OUT0 to OUT15(1) |
±1% | ±8% | ||||
| ΔIO(LC1) | Constant sink current error (see Figure 10) | Device to device, Averaged current from OUT0 to OUT15, R(IREF) = 1920 Ω (20 mA)(2) | –2% +0.4% |
±4% | ||
| ΔIO(LC2) | Constant sink current error (see Figure 10) | Device to device, Averaged current from OUT0 to OUT15, R(IREF) = 480 Ω (80 mA)(2) | –2.7% +2% |
±4% | ||
| ΔIO(LC3) | Line regulation (see Figure 10) | All output ON, VO = 1V, R(IREF) = 640 Ω OUT0 to OUT15, VCC = 3 V to 5.5 V(3) |
±1 | ±4 | %/V | |
| All output ON, VO = 1V, R(IREF) = 320 Ω , OUT0 to OUT15, VCC = 3 V to 5.5 V(3) |
±1 | ±6 | %/V | |||
| ΔIO(LC4) | Load regulation (see Figure 10) | All output ON, VO = 1 V to 3 V, R(IREF) = 640 Ω, OUT0 to OUT15(4) |
±2 | ±6 | %/V | |
| All output ON, VO = 1 V to 3 V, R(IREF) = 320 Ω, OUT0 to OUT15(4) |
±2 | ±8 | %/V | |||
| T(TEF) | Thermal error flag threshold | Junction temperature(5) | 150 | 170 | °C | |
| V(LED) | LED open detection threshold | 0.3 | 0.4 | V | ||
| V(IREF) | Reference voltage output |
R(IREF) = 640 Ω | 1.20 | 1.24 | 1.28 | V |
(1) The deviation of each output from the average of OUT0-15 constant current. It is calculated by Equation 1 in Test Parameter Equations.
(2) The deviation of average of OUT1-15 constant current from the ideal constant-current value. It is calculated by Equation 2 in Test Parameter Equations. The ideal current is calculated by Equation 3 in Test Parameter Equations.
(3) The line regulation is calculated by Equation 4 in Test Parameter Equations.
(4) The load regulation is calculated by Equation 5 in Test Parameter Equations.
(5) Not tested. Specified by design
6.6 Switching Characteristics
VCC = 3V to 5.5V, TA = -40°C to 85°C (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| tr0 | Rise time | SOUT | 16 | ns | ||
| tr1 | OUTn, VCC = 5 V, TA = 60°C, DCn = 3 Fh | 10 | 30 | |||
| tf0 | Fall time | SOUT | 16 | ns | ||
| tf1 | OUTn, VCC = 5 V, TA = 60°C, DCn = 3 Fh | 10 | 30 | |||
| tpd0 | Propagation delay time | SCLK to SOUT (see Figure 11) | 30 | ns | ||
| tpd1 | BLANK to OUT0 | 60 | ns | |||
| tpd2 | OUTn to XERR (see Figure 11) | 1000 | ns | |||
| tpd3 | GSCLK to OUT0 (see Figure 11) | 60 | ns | |||
| tpd4 | XLAT to IOUT (dot correction) (see Figure 11) | 60 | ns | |||
| tpd5 | DCPRG to OUT0 (see Figure 11) | 30 | ns | |||
| td | Output delay time | OUTn to OUT(n+1) (see Figure 11) | 20 | 30 | ns | |
| ton-err | Output on-time error | touton– Tgsclk (see Figure 11), GSn = 01h, GSCLK = 11 MHz | 10 | –50 | –90 | ns |
6.7 Typical Characteristics
Figure 1. Reference Resistor vs Output Current
Figure 3. Output Current vs Output Voltage
Figure 5. Constant Output Current, ΔIOLC
vs Ambient Temperature
Figure 7. Output Current vs DOT Correction Linearity (ABS Value)
Figure 2. Power Dissipation Rate vs Free-Air Temperature
Figure 4. Output Current vs Output Voltage
Figure 6. Constant Output Current, ΔIOLC
vs Output Current
Figure 8. Output Current vs DOT Correction Linearity (ABS Value)