ZHCSEM2A August 2015 – August 2015 TLC6C5712-Q1
PRODUCTION DATA.
To prevent thermal shutdown, the junction temperature, TJ, must be less than 150°C. If the voltage drop across the output channels is high, the device power dissipation can be large. The TLC6C5712-Q1 device has very good thermal performance because of the thermal pad design; however, the PCB layout is also very important to ensure that the device has good thermal performance. Good PCB design can optimize heat transfer, which is essential for the long-term reliability of the device.
Use the following guidelines when designing the device layout: