ZHCSIO0A December   2017  – August 2018 TLC6C5724-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     典型应用原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Maximum Constant-Sink-Current Setting
      2. 7.3.2 Brightness Control and Dot Correction
      3. 7.3.3 Grayscale Configuration
        1. 7.3.3.1 PWM Auto Repeat
        2. 7.3.3.2 PWM Timing Reset
      4. 7.3.4 Diagnostics
        1. 7.3.4.1  LED Diagnostics
        2. 7.3.4.2  Adjacent-Pin-Short Check
        3. 7.3.4.3  IREF Short and IREF Open Detection
        4. 7.3.4.4  Pre-Thermal Warning Flag
        5. 7.3.4.5  Thermal Error Flag
        6. 7.3.4.6  Negate Bit Toggle
        7. 7.3.4.7  LOD_LSD Self-Test
        8. 7.3.4.8  ERR Pin
        9. 7.3.4.9  ERROR Clear
        10. 7.3.4.10 Global Reset
        11. 7.3.4.11 Slew Rate Control
        12. 7.3.4.12 Channel Group Delay
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Up
      2. 7.4.2 Device Initialization
      3. 7.4.3 Fault Mode
      4. 7.4.4 Normal Operation
    5. 7.5 Programming
      1. 7.5.1 Register Write and Read
        1. 7.5.1.1 FC-BC-DC Write
          1. 7.5.1.1.1 FC Data Write
          2. 7.5.1.1.2 BC Data Write
          3. 7.5.1.1.3 DC Data Write
        2. 7.5.1.2 Grayscale Data Write
        3. 7.5.1.3 Special Command Function
          1. 7.5.1.3.1 GS Read
          2. 7.5.1.3.2 FC-BC-DC Read
          3. 7.5.1.3.3 Status Information Data Read
    6. 7.6 Register Maps
      1. 7.6.1 GRAYSCALE Registers
        1. 7.6.1.1 OUTn_GS Register (Offset = 0h)
          1. Table 25. OUTn_GS Register Field Descriptions
      2. 7.6.2 FC-BC-DC Registers
        1. 7.6.2.1 FC-BC-DC Register (Offset = 1h)
          1. Table 28. FC-BC-DC Register Field Descriptions
      3. 7.6.3 SID Registers
        1. 7.6.3.1 SID Register (Offset = 2h)
          1. Table 31. SID Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Timing Requirements

VCC = 3 V to 5.5 V,TJ=–40°Cto150°C.
MIN NOM MAX UNIT
fCLK(SCK) SCK data-shift clock frequency 4 MHz
fCLK(GCLK) GCLK grayscale clock frequency 8 MHz
tWH0 SCK high pulse duration 60 ns
tWL0 SCK low pulse duration 60 ns
tWH1 LATCH high pulse duration 80 ns
tWL1 LATCH low pulse duration 80 ns
tWL2 BLANK pulse duration 80 ns
tWH3 GCLK high pulse duration 40 ns
tWL3 GCLK low pulse duration 40 ns
tSU0 SDI - SCK↑ setup time 55 ns
tSU1 BLANK↑– GCLK↑ setup time 60 ns
tSU2 LATCH↑ – SCK↑ setup time 200 ns
tSU3 LATCH↑for GS data – GCLK↑when display timing reset mode is disabled , setup time 90 ns
tSU4 LATCH↑for GS data – GCLK↑ when display timing reset mode is enabled, setup time 150 ns
tH0 SCK↑– SDI hold time 55 ns
tH1 SCK↑– LATCH↑ hold time 85 ns
tH2 SCK↑– LATCH↓ hold time 55 ns
tRI0 SDI, SCK, LATCH rise time 50 ns
tRI1 GCLK rise time 30 ns
tFI0 SDI, SCK, LATCH fall time 50 ns
tFI1 GCLK fall time 30 ns