ZHCSIO0A December   2017  – August 2018 TLC6C5724-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     典型应用原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Maximum Constant-Sink-Current Setting
      2. 7.3.2 Brightness Control and Dot Correction
      3. 7.3.3 Grayscale Configuration
        1. 7.3.3.1 PWM Auto Repeat
        2. 7.3.3.2 PWM Timing Reset
      4. 7.3.4 Diagnostics
        1. 7.3.4.1  LED Diagnostics
        2. 7.3.4.2  Adjacent-Pin-Short Check
        3. 7.3.4.3  IREF Short and IREF Open Detection
        4. 7.3.4.4  Pre-Thermal Warning Flag
        5. 7.3.4.5  Thermal Error Flag
        6. 7.3.4.6  Negate Bit Toggle
        7. 7.3.4.7  LOD_LSD Self-Test
        8. 7.3.4.8  ERR Pin
        9. 7.3.4.9  ERROR Clear
        10. 7.3.4.10 Global Reset
        11. 7.3.4.11 Slew Rate Control
        12. 7.3.4.12 Channel Group Delay
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Up
      2. 7.4.2 Device Initialization
      3. 7.4.3 Fault Mode
      4. 7.4.4 Normal Operation
    5. 7.5 Programming
      1. 7.5.1 Register Write and Read
        1. 7.5.1.1 FC-BC-DC Write
          1. 7.5.1.1.1 FC Data Write
          2. 7.5.1.1.2 BC Data Write
          3. 7.5.1.1.3 DC Data Write
        2. 7.5.1.2 Grayscale Data Write
        3. 7.5.1.3 Special Command Function
          1. 7.5.1.3.1 GS Read
          2. 7.5.1.3.2 FC-BC-DC Read
          3. 7.5.1.3.3 Status Information Data Read
    6. 7.6 Register Maps
      1. 7.6.1 GRAYSCALE Registers
        1. 7.6.1.1 OUTn_GS Register (Offset = 0h)
          1. Table 25. OUTn_GS Register Field Descriptions
      2. 7.6.2 FC-BC-DC Registers
        1. 7.6.2.1 FC-BC-DC Register (Offset = 1h)
          1. Table 28. FC-BC-DC Register Field Descriptions
      3. 7.6.3 SID Registers
        1. 7.6.3.1 SID Register (Offset = 2h)
          1. Table 31. SID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.4.3 IREF Short and IREF Open Detection

To protect the device from a reference-resistor short or open fault, the device integrates IREF short and open protection. In an IREF short or open fault condition, the device reports the fault and sets the output current to a default value to help improve the system safety.

By default, the ISF and IOF flags are 0. When the IREF current exceeds the fault-detection threshold, the ERR pin is pulled down, the ISF or IOF flag is set to 1. The error flag and ERR pin status stay unchanged until the fault is removed and there is an ERROR clear command.

Once there is an ISF or IOF failure, the output current is set to a default value, I(OUT)max, of 10 mA, see Table 11. Once the ISF or IOF failure is removed, the output current returns back to the IREF setting value immediately.

Table 11. Criteria of ISF/IOF Judgement and Corresponding Actions

IIREF ISF IOF OUTPUT
IIREF ≤ 10 µA 0 1 I(OUT)max= 10 mA
10 µA < IIREF ≤ 3 mA 0 0 I(OUT)max = VIREF × 40 / RIREF
IIREF > 3 mA 1 0 I(OUT)max = 10 mA
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