米6体育平台手机版

ZHCSK68B August 2019 – June 2022 TLIN1028-Q1

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

D|8
- MSOI002K
DDA|8
- MPDS092F
DRB|8
- MPDS118K

散热焊盘机械数据 (封装 | 引脚)

DDA|8
- PPTD178C
DRB|8
- QFND619

订购信息

7.9 Typical Characteristics

Package = D

V_CC = 3.3 V

Temp = Ambient

Figure 7-1 I_CC vs V_SUP vs Temperature

Package = DDA

V_CC = 3.3 V

Temp = Ambient

Figure 7-3 I_CC vs V_SUP vs Temperature

Package = DRB

V_CC = 5 V

Temp = Ambient

Figure 7-5 I_CC vs V_SUP vs Temperature

Note:

Package = D

V_CC = 3.3 V

Temp = Ambient

Figure 7-7 Sleep Mode Current Across V_SUP and Temperature

Package = DDA

V_CC = 3.3 V

Temp = Ambient

Figure 7-9 Sleep Mode Current Across V_SUP and Temperature

Package = DRB

V_CC = 5 V

Temp = Ambient

Figure 7-11 Sleep Mode Current Across V_SUP and Temperature

Package = DRB

V_CC = 3.3 V

Temp = Ambient

Figure 7-2 I_CC vs V_SUP vs Temperature

Package = D

V_CC = 5 V

Temp = Ambient

Figure 7-4 I_CC vs V_SUP vs Temperature

Package = DDA

V_CC = 5 V

Temp = Ambient

Figure 7-6 I_CC vs V_SUP vs Temperature

Package = DRB

V_CC = 3.3 V

Temp = Ambient

Figure 7-8 Sleep Mode Current Across V_SUP and Temperature

Package = D

V_CC = 5 V

Temp = Ambient

Figure 7-10 Sleep Mode Current Across V_SUP and Temperature

Package = DDA

V_CC = 5 V

Temp = Ambient

Figure 7-12 Sleep Mode Current Across V_SUP and Temperature

Note: For the LDO I_CC vs V_SUP vs Temperature typical curves the data was collected on a high-k EVM board using a forced air system. The curves show performance based upon thermal resistance R_θJB.