ZHCSKI2B November   2019  – May 2022 TLIN1028S-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specification
    1. 7.1 ABSOLUTE MAXIMUM RATINGS
    2. 7.2 ESD RATINGS
    3. 7.3 ESD RATINGS, IEC SPECIFICATION
    4. 7.4 RECOMMENDED OPERATING CONDITIONS
    5. 7.5 THERMAL INFORMATION
    6. 7.6 POWER SUPPLY CHARACTERISTICS
    7. 7.7 ELECTRICAL CHARACTERISTICS
    8. 7.8 AC SWITCHING CHARACTERISTICS
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit: Diagrams and Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 LIN Pin
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2 TXD (Transmit Input)
      3. 9.3.3 RXD (Receive Output)
      4. 9.3.4 VSUP (Supply Voltage)
      5. 9.3.5 GND (Ground)
      6. 9.3.6 EN (Enable Input)
      7. 9.3.7 nRST (Reset Output)
      8. 9.3.8 VCC (Supply Output)
      9. 9.3.9 Protection Features
        1. 9.3.9.1 TXD Dominant Time Out (DTO)
        2. 9.3.9.2 Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 9.3.9.3 Thermal Shutdown
        4. 9.3.9.4 Under Voltage on VSUP
        5. 9.3.9.5 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
      5. 9.4.5 Mode Transitions
      6. 9.4.6 Voltage Regulator
        1. 9.4.6.1 VCC
        2. 9.4.6.2 Output Capacitance Selection
        3. 9.4.6.3 Low-Voltage Tracking
        4. 9.4.6.4 Power Supply Recommendation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Normal Mode Application Note
        2. 10.2.1.2 TXD Dominant State Timeout Application Note
        3. 10.2.1.3 Brownout
      2. 10.2.2 Detailed Design Procedures
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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7.6 POWER SUPPLY CHARACTERISTICS

parameters valid over –40℃ ≤ TJ ≤ 150 ℃ range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE AND CURRENT
VSUP Operational supply voltage (ISO/DIS 17987 Param 10) Device is operational beyond the LIN defined nominal supply voltage range. See Figure 8-1 and Figure 8-2 5.5 36 V
VSUP Nominal supply voltage (ISO/DIS 17987 Param 10): Normal and Standby Modes: Ramp VSUP while LIN signal is a 10 kHz square wave with 50 % duty cycle and swing between 5.5 V ≤ VLIN ≤ 28 V. See Figure 8-1and Figure 8-2 5.5 28 V
Sleep Mode 5.5   28 V
UVSUPR Under voltage VSUP threshold Ramp Up 3.5 4.2 V
UVSUPF Under voltage VSUP threshold  Ramp Down 1.8 2.1 2.5 V
UVHYS Delta hysteresis voltage for VSUP under voltage threshold 1.5 V
ISUP Transceiver and LDO supply current Transceiver normal mode dominant plus LDO output 80 mA
ISUPTRXDOM Supply current transceiver only Normal Mode: EN = VCC, bus dominant: total bus load where RLIN ≥ 500 Ω and CLIN ≤ 10 nF  1.2 5 mA
Standby Mode: EN = 0 V, bus dominant: total bus load where RLIN ≥ 500 Ω and CLIN ≤ 10 nF  1 1.8 mA
ISUPTRXREC Supply current transceiver only Normal Mode: EN = VCC,
Bus recessive: LIN = VSUP,		 450 775 µA
Standby Mode: EN = 0 V, LIN = recessive = VSUP, IOZH from processor ≤ 1 µA 38 55 µA
Added Standby Mode current through the RXD pull-up resistor with a value of 100 kΩ: EN = 0 V, LIN = recessive = VSUP, RXD = GND(1) 55
ISUPTRXSLP Sleep mode supply current transceiver only 5.5 V < VSUP ≤ 28 V, LIN = VSUP, EN = 0 V, TXD and RXD floating 17 33 µA
REGULATED OUTPUT VCC
VCC Regulated output VSUP = 5.5 to 28 V, ICC = 1 to 70 mA –2 2 %
∆VCC(∆VSUP) Line regulation VSUP = 5.5 to 28 V, ΔVCC, ICC = 10 mA 50 mV
∆VCC(∆VSUPL) Load regulation ICC = 1 to 70 mA, VSUP = 14 V, ΔVCC 50 mV
VDROP Dropout voltage (5 V LDO) VSUP – VCC, ICC = 70 mA; 300 600 mV
VDROP Dropout voltage (3.3 V LDO) VSUP – VCC, ICC = 70 mA; 350 700 mV
UVCC5R Under voltage 5 V VCC threshold Ramp Up   4.7 4.86 V
UVCC5F Under voltage 5 V VCC threshold Ramp Down 4.2 4.45 V
UVCC33R Under voltage 3.3 V VCC threshold (2) Ramp Up   2.9 3.1 V
UVCC33F Under voltage 3.3 V VCC threshold (2) Ramp Down 2.5 2.75   V
tDET(UVCC) VCC undervoltage deglitch time.  An UVCC event will not be recognized unless it last longer than this. (2) CnRST = 20pF 1 15 µs
ICCOUT Output current VCC in regulation with 12 V VSUP 0 70 mA
ICCOUTL Output current limit VCC short to ground 275 mA
PSRR Power supply rejection ripple rejection VRIP = 0.5 VPP, Load = 10 mA, ƒ = 100 Hz, CO = 10 μF 60 dB
TSDR Thermal shutdown temperature Internal junction temperature - rising 165 °C
TSDF Thermal shutdown temperature Internal junction temperature - falling 150 °C
TSDHYS Thermal shutdown hysteresis 10 °C
(1) RXD pin is an open drain output.  In standby mode RXD is pulled low which has the device pulling current through VSUP through the pull-up resistor to VCC.  The value of the pull-up resistor impacts the standby mode current.  A 10 kΩ resistor value can add as much at 500 µA of current.
(2) Specified by design
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