ZHCSQ68A May   2022  – December 2022 TLIN1431-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings, IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Supply Characteristics
    7. 6.7 Electrical Characteristics
    8. 6.8 AC Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuit: Diagrams and Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  LIN (Local Interconnect Network) Bus
        1. 8.3.1.1 LIN Transmitter Characteristics
        2. 8.3.1.2 LIN Receiver Characteristics
          1. 8.3.1.2.1 Termination
      2. 8.3.2  TXD (Transmit Input and Output)
      3. 8.3.3  RXD (Receive Output)
      4. 8.3.4  WAKE (High Voltage Local Wake Up Input)
      5. 8.3.5  WDT or CLK (Pin Programmable Watchdog Delay Input or SPI Clock)
      6. 8.3.6  WDI or SDI (Watchdog Timer Input or SPI Serial Data In)
      7. 8.3.7  PIN or nCS (Pin Watchdog Select or SPI Chip Select)
      8. 8.3.8  LIMP (Limp Home Output – High Voltage Open Drain Output)
        1. 8.3.8.1 LIMP in Pin Control Mode
        2. 8.3.8.2 LIMP in SPI Control Mode
      9. 8.3.9  nWDR/SDO (Watchdog Timeout Reset Output/SPI Serial Data Out)
      10. 8.3.10 HSS (High-side Switch)
      11. 8.3.11 HSSC or FSO (High-side Switch Control or Function Output)
      12. 8.3.12 WKRQ or INH (Wake Request or Inhibit)
      13. 8.3.13 PV
      14. 8.3.14 DIV_ON
      15. 8.3.15 VBAT (Battery Voltage)
      16. 8.3.16 VSUP (Supply Voltage)
      17. 8.3.17 GND (Ground)
      18. 8.3.18 EN or nINT (Enable Input or Interrupt Output)
      19. 8.3.19 nRST (Reset Input and Reset Output)
      20. 8.3.20 VCC (Supply Output)
      21. 8.3.21 VBAT Voltage Divider
      22. 8.3.22 Protection Features
        1. 8.3.22.1  Sleep Wake Error (SWE) Timer
        2. 8.3.22.2  Device Reset
        3. 8.3.22.3  TXD Dominant Time Out (DTO)
        4. 8.3.22.4  Bus Stuck Dominant System Fault: False Wake Up Lockout
        5. 8.3.22.5  Thermal Shutdown
        6. 8.3.22.6  Under-voltage on VSUP
        7. 8.3.22.7  Unpowered Device and LIN Bus
        8. 8.3.22.8  Floating Pins
        9. 8.3.22.9  VCC Voltage Regulator
          1. 8.3.22.9.1 Under or Over Voltage and Short Circuit
          2. 8.3.22.9.2 Output Capacitance Selection
          3. 8.3.22.9.3 Low-Voltage Tracking
          4. 8.3.22.9.4 Power Supply Recommendation
        10. 8.3.22.10 Watchdog
          1. 8.3.22.10.1 Watchdog in Pin Control Mode
          2. 8.3.22.10.2 Watchdog in SPI Control Mode
          3. 8.3.22.10.3 Watchdog Error Counter
          4. 8.3.22.10.4 Pin Control Mode
          5. 8.3.22.10.5 SPI Control Programming
          6. 8.3.22.10.6 Watchdog Register Relationship
          7. 8.3.22.10.7 Watchdog Timing
      23. 8.3.23 Channel Expansion
        1. 8.3.23.1 Channel Expansion for LIN
        2. 8.3.23.2 Channel Expansion for CAN Transceiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 Init Mode
      2. 8.4.2 Normal Mode
      3. 8.4.3 Fast Mode
      4. 8.4.4 Sleep Mode
      5. 8.4.5 Standby Mode
      6. 8.4.6 Restart Mode
        1. 8.4.6.1 Restart Counter
        2. 8.4.6.2 nRST Behavior in Restart Mode
      7. 8.4.7 Fail-safe Mode
      8. 8.4.8 Wake Up Events
        1. 8.4.8.1 Wake Up Request (RXD)
        2. 8.4.8.2 Local Wake Up (LWU) via WAKE Terminal
          1. 8.4.8.2.1 Static WAKE
          2. 8.4.8.2.2 Cyclic Sense Wake
      9. 8.4.9 Mode Transitions
    5. 8.5 Programming
      1. 8.5.1 SPI Communication
        1. 8.5.1.1 Cyclic Redundancy Check
        2. 8.5.1.2 Chip Select Not (nCS)
        3. 8.5.1.3 Serial Clock Input (CLK)
        4. 8.5.1.4 Serial Data Input (SDI)
        5. 8.5.1.5 Serial Data Output (SDO)
    6. 8.6 Registers
      1. 8.6.1  DEVICE_ID_y Register (Address = 0h + formula) [reset = 0h]
      2. 8.6.2  REV_ID_MAJOR Register (Address = 8h) [reset = 01h]
      3. 8.6.3  REV_ID_MINOR Register (Address = 9h) [reset = 0h]
      4. 8.6.4  CRC_CNTL Register (Address = Ah) [reset = 0h]
      5. 8.6.5  CRC_POLY_SET (Address = Bh) [reset = 00h]
      6. 8.6.6  Scratch_Pad_SPI Register (Address = Fh) [reset = 0h]
      7. 8.6.7  WAKE_PIN_CONFIG1 Register (Address = 11h) [reset = 04h]
      8. 8.6.8  WAKE_PIN_CONFIG2 Register (Address = 12h) [reset = 2h]
      9. 8.6.9  WD_CONFIG_1 Register (Address = 13h) [reset = 90h]
      10. 8.6.10 WD_CONFIG_2 Register (Address = 14h) [reset = 02h]
      11. 8.6.11 WD_INPUT_TRIG Register (Address = 15h) [reset = 0h]
      12. 8.6.12 WD_RST_PULSE Register (Address = 16h) [reset = 40h]
      13. 8.6.13 FSM_CONFIG Register (Address = 17h) [reset = 0h]
      14. 8.6.14 FSM_CNTR Register (Address = 18h) [reset = 0h]
      15. 8.6.15 DEVICE_RST Register (Address = 19h) [reset = 0h]
      16. 8.6.16 DEVICE_CONFIG (Address = 1Ah) [reset = 80h]
      17. 8.6.17 DEVICE_CONFIG2 (Address = 1Bh) [reset = 0h]
      18. 8.6.18 SWE_TIMER (Address = 1Ch) [reset = 30h]
      19. 8.6.19 LIN_CNTL (Address = 1Dh) [reset = 00h]
      20. 8.6.20 HSS_CNTL (Address = 1Eh) [reset = 0h]
      21. 8.6.21 PWM1_CNTL1 (Address = 1Fh) [reset = 0h]
      22. 8.6.22 PWM1_CNTL2 (Address = 20h) [reset = 0h]
      23. 8.6.23 PWM1_CNTL3 (Address = 21h) [reset = 00h]
      24. 8.6.24 PWM2_CNTL1 (Address = 22h) [reset = 0h]
      25. 8.6.25 PWM2_CNTL2 (Address = 23h) [reset = 0h]
      26. 8.6.26 PWM2_CNTL3 (Address = 24h) [reset = 0h]
      27. 8.6.27 TIMER1_CONFIG (Address = 25h) [reset = 00h]
      28. 8.6.28 TIMER2_CONFIG (Address = 26h) [reset = 00h]
      29. 8.6.29 RSRT_CNTR (Address = 28h) [reset = 40h]
      30. 8.6.30 nRST_CNTL (Address = 29h) [reset = 00h]
      31. 8.6.31 INT_GLOBAL Register (Address = 50h) [reset = A0h]
      32. 8.6.32 INT_1 Register (Address = 51h) [reset = 0h]
      33. 8.6.33 INT_2 Register (Address = 52h) [reset = 40h]
      34. 8.6.34 INT_3 Register (Address 53h) [reset = 0h]
      35. 8.6.35 INT_EN_1 Register (Address = 56h) [reset = B0h]
      36. 8.6.36 INT_EN_2 Register (Address = 57h) [reset = 37h]
      37. 8.6.37 INT_EN_3 Register (Address =58h) [reset = BCh]
      38. 8.6.38 INT_4 Register (Address = 5Ah) [reset = 0h]
      39. 8.6.39 INT_EN_4 Register (Address = 5Eh) [reset = CCh]
      40. 8.6.40 Reserved Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Brownout Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Normal Mode Application Note
        2. 9.2.1.2 Standby Mode Application Note
        3. 9.2.1.3 TXD Dominant State Timeout Application Note
      2. 9.2.2 Detailed Design Procedures
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 商标
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGY|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.4.1 Layout Guidelines

The layout example and information below are for a responder node with the following configuration: See Figure 9-14.
  • Responder node
  • SPI control
  • WKRQ
  • WAKE and High-side switch configured for cyclic sensing

The following are the layout guidelines based upon the provided configuration:

  • Pin 1 (VSUP): This is the supply pin for the device. A 100 nF decoupling capacitor (C1) should be placed as close to the device as possible. Other bulk decoupling capacitance should be considered.
  • Pin 2 (VCC): Output source, either 3.3 V or 5 V depending upon the version of the device and has a 10 μF decoupling capacitor (C2) to ground as close to the device as possible. This pin is connected to external circuitry for a limp home mode if the watchdog has timed out causing a reset
  • Pin 3 (nRST): This pin connects to the processors and functions in one of two manners; as a reset pin for the TLIN1431x-Q1 or an indicator to the processor of an under-voltage and watchdog failure event. The pin has a 10 kΩ resistor (R1) pulled up to the processor I/O voltage rail.
  • Pin 4 (WDT/CLK): In SPI control mode, this pin (CLK) is connected directly to the processor as the SPI CLK input to the TLIN1431x-Q1.
  • Pin 5 (nWDR/SDO): In SPI control mode, this pin (SDO) is connected directly to the processor as the SPI serial data output from the TLIN1431x-Q1.
  • Pin 6 (WDI/SDI): In SPI control mode, this pin (SDI) is connected directly to the processor as the SPI serial data input into the TLIN1431x-Q1.
  • Pin 7 (PIN/nCS): For SPI control mode, this pin (nCS) should be connected directly to the processor as the SPI chip select to the TLIN1431x-Q1.
  • Pin 8 (EN/nINT): In SPI control mode, this pin becomes an output interrupt pin that is provided to the processor.
  • Pin 9 (HSSC/FSO): In SPI control mode, this pin (FSO) is connected directly to the processor, external transceiver or general purpose SBC as a selectable interrupt or control pin.
  • Pin 10 (PV): This pin is connected directly to a processor ADC and has a 20 pF capacitor (C3) to GND.
  • Pin 11 (DIV_ON): The pin is connected to a processor which controls when the VBAT monitoring in the TLIN1431x-Q1 is enabled.
  • Pin 12 (TXD): The TXD pin is the LIN transceiver input from the processors. A series resistor can be placed to limit the input current to the device in the event of an over-voltage on this pin. A capacitor to ground can be placed close to the input pin of the device to filter noise. These are system level dependent and not covered here as usually not needed.
  • Pin 13 (RXD): The RXD is the LIN transceiver receive output to the processor. The pin is a push-pull output and can be connected directly to the processor without external pull-ups.
  • Pin 14 (GND): This is the ground connection for the device. This pin should be tied to the ground plane through a short trace with the use of two vias to limit total return inductance.
  • Pin 15 (LIN): This pin connects to the LIN bus. For responder nodes, a 220 pF capacitor (C4) to ground is implemented. For commander nodes, an additional series resistor and blocking diode should be placed between the LIN pin and the VSUP pin.
  • Pin 16 (WKRQ/INH): This pin can be the high-voltage inhibit output pin or the digital wake output pin. The example shows the pin configured as WKRQ which requires a 100 kΩ resistor (R2) to ground at power up.
  • Pin 17 (WAKE): This pin connects to VSUP through a resistor divider (R3 and R4) with the center tap connected to a switch to ground or VSUP and is used as the local wake up pin. A 10 nF capacitor (C5) to ground should be placed at this center tap as shown in the application drawings. In the layout example, the pin is configured to work with the HSS pin using the cyclic sensing wake capability of the device.
  • Pin 18 (HSS): This pin is the high-side switch output
  • Pin 19 (LIMP): This pin as a high-side switch that is used for a limp home function that provides VSUP to an external circuit which is not shown.
  • Pin 20 (VBAT): This pin is used for battery monitoring is comes from the battery prior to the blocking diode. It has a 470 Ω resistor (R5) in series and a 100 nF capacitor (C6) to GND.
Note:

All ground and power connections should be made as short as possible and use at least two vias to minimize the total loop inductance.
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