The TLIN1431x-Q1 has multiple thermal sensors in the device to monitor the junction temperature of the die. The V_CC LDO, LIN transmitter, and high side switch/LIMP cells are monitored. Depending upon which cell's junction temperature are exceeded will determine the action taken by the device. Exceeding the maximum junction temperature for the LIN transmitter or LDO will cause the LIN transmitter into the recessive state and turns off the V_CC regulator. The nRST pin is pulled to ground during a LIN or V_CC LDO TSD event. Once the over temperature fault condition has been removed and the junction temperature has cooled beyond the hysteresis temperature, the transmitter can be re-enabled. Exceeding the max junction temperature of the high side switch or LIMP cells will cause the cells to be turned off.

In pin control mode, a TSD event on the LIN transceiver or V_CC LDO causes the device enters a fail-safe mode. Once the TSD fault has been removed and a wake event takes place, the device enters restart mode. If a wake event takes place and the TSD fault has not cleared, the device enters sleep mode immediately. Exceeding the max junction temperature for the high side switch and LIMP high side switch cause the switches to be turned off until junction temperature falls below T_SDF.

In SPI mode, there are two interrupts that can be set due to a thermal event. If the LIN transceiver or V_CC LDO junction temperature is exceeded, the TSD_VCC_LIN interrupt is set and the devices takes the action previously described. If the high side switch or LIMP high side switch max junction temperature is exceeded, the TSD_HSS_LIMP interrupt is set. The device takes the action previously described. In SPI mode, the device defaults to support fail-safe mode. The device enters fail-safe mode upon an TSD_VCC_LIN event and LIMP is turned on (see Figure 8-25). Exiting fail-safe mode is the same as when the device is pin controlled. When fail-safe mode is disabled, the device enters sleep mode upon a TSD_VCC_LIN event.