ZHCSNE4 June   2022 TLIN2024A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Thermal Information
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 Duty Cycle Characteristics
    8. 7.8 Switching Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN (Local Interconnect Network) Bus
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD (Transmit Input and Output)
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  VSUP1/2 (Supply Voltage)
      5. 9.3.5  GND1/2 (Ground)
      6. 9.3.6  EN (Enable Input)
      7. 9.3.7  Protection Features
      8. 9.3.8  TXD Dominant Time Out (DTO)
      9. 9.3.9  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      10. 9.3.10 Thermal Shutdown
      11. 9.3.11 Under Voltage on VSUP
      12. 9.3.12 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
        2. 9.4.4.2 Mode Transitions
  10. 10Application and Implementation Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Detailed Design Procedures
        2. 10.2.1.2 Normal Mode Application Note
        3. 10.2.1.3 Standby Mode Application Note
        4. 10.2.1.4 TXD Dominant State Timeout Application Note
      2. 10.2.2 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

7.4 Thermal Information

THERMAL METRIC(1) TLIN2024A UNIT
RGY (QFN)
24-PINS
RΘJA Junction-to-ambient thermal resistance 34.3 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 30.8 °C/W
RΘJB Junction-to-board thermal resistance 13.3 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 13.3 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance 2.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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