SLLSEE3D August   2013  – April 2016 TLK105L , TLK106L

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Pin Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Serial Management Interface (SMI)
    3. 3.3 MAC Data Interface
    4. 3.4 10Mbs and 100Mbs PMD Interface
    5. 3.5 Clock Interface
    6. 3.6 LED Interface
    7. 3.7 Reset and Power Down
    8. 3.8 Power and Bias Connections
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 20
      1. 4.4.1 TLK105L 32-Pin Industrial Device (85°C) Thermal Characteristics
    5. 4.5 TLK106L 32-Pin Extended Temperature (105°C) Device Thermal Characteristics
    6. 4.6 DC Characteristics, VDD_IO
    7. 4.7 DC Characteristics
    8. 4.8 Power Supply Characteristics
      1. 4.8.1 Active Power, Single Supply Operation
      2. 4.8.2 Active Power, Dual Supply Operation
      3. 4.8.3 Power-Down Power
    9. 4.9 AC Specifications
      1. 4.9.1  Power Up Timing
      2. 4.9.2  Reset Timing
      3. 4.9.3  MII Serial Management Timing
      4. 4.9.4  100Mb/s MII Transmit Timing
      5. 4.9.5  100Mb/s MII Receive Timing
      6. 4.9.6  100Base-TX Transmit Packet Latency Timing
      7. 4.9.7  100Base-TX Transmit Packet Deassertion Timing
      8. 4.9.8  100Base-TX Transmit Timing (tR/F and Jitter)
      9. 4.9.9  100Base-TX Receive Packet Latency Timing
      10. 4.9.10 100Base-TX Receive Packet Deassertion Timing
      11. 4.9.11 10Mbs MII Transmit Timing
      12. 4.9.12 10Mb/s MII Receive Timing
      13. 4.9.13 10Base-T Transmit Timing (Start of Packet)
      14. 4.9.14 10Base-T Transmit Timing (End of Packet)
      15. 4.9.15 10Base-T Receive Timing (Start of Packet)
      16. 4.9.16 10Base-T Receive Timing (End of Packet)
      17. 4.9.17 10Mb/s Jabber Timing
      18. 4.9.18 10Base-T Normal Link Pulse Timing
      19. 4.9.19 Auto-Negotiation Fast Link Pulse (FLP) Timing
      20. 4.9.20 100Base-TX Signal Detect Timing
      21. 4.9.21 100Mbs Loopback Timing
      22. 4.9.22 10Mbs Internal Loopback Timing
      23. 4.9.23 RMII Transmit Timing
      24. 4.9.24 RMII Receive Timing
      25. 4.9.25 Isolation Timing
  5. 5Detailed Description
    1. 5.1 Hardware Configuration
      1. 5.1.1  Bootstrap Configuration
      2. 5.1.2  Power Supply Configuration
        1. 5.1.2.1 Single Supply Operation
        2. 5.1.2.2 Dual Supply Operation
        3. 5.1.2.3 Variable IO Voltage
      3. 5.1.3  IO Pins Hi-Z State During Reset
      4. 5.1.4  Auto-Negotiation
      5. 5.1.5  Auto-MDIX
      6. 5.1.6  MII Isolate Mode
      7. 5.1.7  PHY Address
      8. 5.1.8  LED Interface
      9. 5.1.9  Loopback Functionality
        1. 5.1.9.1 Near-End Loopback
        2. 5.1.9.2 Far-End Loopback
      10. 5.1.10 BIST
      11. 5.1.11 Cable Diagnostics
        1. 5.1.11.1 TDR
        2. 5.1.11.2 ALCD
    2. 5.2 Architecture
      1. 5.2.1 100Base-TX Transmit Path
        1. 5.2.1.1 MII Transmit Error Code Forwarding
        2. 5.2.1.2 4-Bit to 5-Bit Encoding
        3. 5.2.1.3 Scrambler
        4. 5.2.1.4 NRZI and MLT-3 Encoding
        5. 5.2.1.5 Digital to Analog Converter
      2. 5.2.2 100Base-TX Receive Path
        1. 5.2.2.1  Analog Front End
        2. 5.2.2.2  Adaptive Equalizer
        3. 5.2.2.3  Baseline Wander Correction
        4. 5.2.2.4  NRZI and MLT-3 Decoding
        5. 5.2.2.5  Descrambler
        6. 5.2.2.6  5B/4B Decoder and Nibble Alignment
        7. 5.2.2.7  Timing Loop and Clock Recovery
        8. 5.2.2.8  Phase-Locked Loops (PLL)
        9. 5.2.2.9  Link Monitor
        10. 5.2.2.10 Signal Detect
        11. 5.2.2.11 Bad SSD Detection
      3. 5.2.3 10Base-T Receive Path
        1. 5.2.3.1 10M Receive Input and Squelch
        2. 5.2.3.2 Collision Detection
        3. 5.2.3.3 Carrier Sense
        4. 5.2.3.4 Jabber Function
        5. 5.2.3.5 Automatic Link Polarity Detection and Correction
        6. 5.2.3.6 10Base-T Transmit and Receive Filtering
        7. 5.2.3.7 10Base-T Operational Modes
      4. 5.2.4 Auto Negotiation
        1. 5.2.4.1 Operation
        2. 5.2.4.2 Initialization and Restart
        3. 5.2.4.3 Next Page Support
      5. 5.2.5 Link Down Functionality
      6. 5.2.6 IEEE 1588 Precision Timing Protocol Support
    3. 5.3 Register Maps
      1. 5.3.1  Register Definition
        1. 5.3.1.1  Basic Mode Control Register (BMCR)
        2. 5.3.1.2  Basic Mode Status Register (BMSR)
        3. 5.3.1.3  PHY Identifier Register 1 (PHYIDR1)
        4. 5.3.1.4  PHY Identifier Register 2 (PHYIDR2)
        5. 5.3.1.5  Auto-Negotiation Advertisement Register (ANAR)
        6. 5.3.1.6  Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
        7. 5.3.1.7  Auto-Negotiate Expansion Register (ANER)
        8. 5.3.1.8  Auto-Negotiate Next Page Transmit Register (ANNPTR)
        9. 5.3.1.9  Auto-Negotiation Link Partner Ability Next Page Register (ANLNPTR)
        10. 5.3.1.10 Control register 1 (CR1)
        11. 5.3.1.11 Control register 2 (CR2)
        12. 5.3.1.12 Control Register 3 (CR3)
        13. 5.3.1.13 Extended Register Addressing
          1. 5.3.1.13.1 Register Control Register (REGCR)
          2. 5.3.1.13.2 Address or Data Register (ADDAR)
        14. 5.3.1.14 Fast Link Down Status Register
        15. 5.3.1.15 PHY Status Register (PHYSTS)
        16. 5.3.1.16 PHY Specific Control Register (PHYSCR)
        17. 5.3.1.17 MII Interrupt Status Register 1 (MISR1)
        18. 5.3.1.18 MII Interrupt Status Register 2 (MISR2)
        19. 5.3.1.19 False Carrier Sense Counter Register (FCSCR)
        20. 5.3.1.20 Receiver Error Counter Register (RECR)
        21. 5.3.1.21 BIST Control Register (BISCR)
        22. 5.3.1.22 RMII Control and Status Register (RCSR)
        23. 5.3.1.23 LED Control Register (LEDCR)
        24. 5.3.1.24 PHY Control Register (PHYCR)
        25. 5.3.1.25 10Base-T Status/Control Register (10BTSCR)
        26. 5.3.1.26 BIST Control and Status Register 1 (BICSR1)
        27. 5.3.1.27 BIST Control and Status Register2 (BICSR2)
      2. 5.3.2  Cable Diagnostic Control Register (CDCR)
      3. 5.3.3  PHY Reset Control Register (PHYRCR)
      4. 5.3.4  Multi LED Control register (MLEDCR)
      5. 5.3.5  Compliance Test register (COMPTR)
      6. 5.3.6  IEEE1588 Precision Timing Pin Select (PTPPSEL)
      7. 5.3.7  IEEE1588 Precision Timing Configuration (PTPCFG)
      8. 5.3.8  TX_CLK Phase Shift Register (TXCPSR)
      9. 5.3.9  Power Back Off Control Register (PWRBOCR)
      10. 5.3.10 Voltage Regulator Control Register (VRCR)
      11. 5.3.11 Cable Diagnostic Configuration/Result Registers
        1. 5.3.11.1  ALCD Control and Results 1 (ALCDRR1)
        2. 5.3.11.2  Cable Diagnostic Specific Control Registers (CDSCR1 - CDSCR4)
        3. 5.3.11.3  Cable Diagnostic Location Results Register 1 (CDLRR1)
        4. 5.3.11.4  Cable Diagnostic Location Results Register 2 (CDLRR2)
        5. 5.3.11.5  Cable Diagnostic Location Results Register 3 (DDLRR3)
        6. 5.3.11.6  Cable Diagnostic Location Results Register 4 (CDLRR4)
        7. 5.3.11.7  Cable Diagnostic Location Results Register 5 (CDLRR5)
        8. 5.3.11.8  Cable Diagnostic Amplitude Results Register 1 (CDARR1)
        9. 5.3.11.9  Cable Diagnostic Amplitude Results Register 2 (CDARR2)
        10. 5.3.11.10 Cable Diagnostic Amplitude Results Register 3 (CDARR3)
        11. 5.3.11.11 Cable Diagnostic Amplitude Results Register 4 (CDARR4)
        12. 5.3.11.12 Cable Diagnostic Amplitude Results Register 5 (CDARR5)
        13. 5.3.11.13 Cable Diagnostic General Results Register (CDGRR)
        14. 5.3.11.14 ALCD Control and Results 2 (ALCDRR2)
        15. 5.3.11.15 ALCD Control and Results 3 (ALCDRR3)
  6. 6Applications, Implementation, and Layout
    1. 6.1 Interfaces
      1. 6.1.1 Media Independent Interface (MII)
      2. 6.1.2 Reduced Media Independent Interface (RMII)
      3. 6.1.3 Serial Management Interface
        1. 6.1.3.1 Extended Address Space Access
          1. 6.1.3.1.1 Write Address Operation
          2. 6.1.3.1.2 Read Address Operation
          3. 6.1.3.1.3 Write (no post increment) Operation
          4. 6.1.3.1.4 Read (no post increment) Operation
          5. 6.1.3.1.5 Write (post increment) Operation
          6. 6.1.3.1.6 Read (post increment) Operation
    2. 6.2 Reset and Power-Down Operation
      1. 6.2.1 Hardware Reset
      2. 6.2.2 Software Reset
      3. 6.2.3 Power Down/Interrupt
        1. 6.2.3.1 Power Down Control Mode
        2. 6.2.3.2 Interrupt Mechanisms
      4. 6.2.4 Power Save Modes
    3. 6.3 Design Guidelines
      1. 6.3.1 TPI Network Circuit
      2. 6.3.2 Clock In (XI) Requirements
        1. 6.3.2.1 Oscillator
        2. 6.3.2.2 Crystal
      3. 6.3.3 Thermal Vias Recommendation
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
    2. 7.2 Related Links
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Device and Documentation Support

7.1 Documentation Support

The following documents describe the TLK10xL devices. Copies of these documents are available on the Internet at www.ti.com.

    SLVA531TLK1XX Design & Layout Guide.

7.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7-1 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TLK105L Click here Click here Click here Click here Click here
TLK106L Click here Click here Click here Click here Click here

7.3 Community Resources

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.

7.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

7.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.
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