ZHCSFO7A November 2016 – May 2018 TLV170 , TLV2170 , TLV4170
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV170 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DBV (SOT-23) | |||
| 8 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 149.5 | 245.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 97.9 | 133.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 87.7 | 83.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 35.5 | 18.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 89.5 | 83.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |