SLOS890C October 2015 – December 2019 TLV1701-Q1 , TLV1702-Q1 , TLV1704-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV1701-Q1 | TLV1702-Q1 | TLV1704-Q1 | UNIT | ||
|---|---|---|---|---|---|---|
| DBV (SOT-23) | DCK (SC-70) | DGK (VSSOP) | PW (TSSOP) | |||
| 5 PINS | 5 PINS | 8 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 233.1 | 222.5 | 199 | 128.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 156.4 | 137.2 | 89.5 | 56.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 60.6 | 71.3 | 120.4 | 69.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 35.7 | 44.6 | 22 | 9.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 59.7 | 71.0 | 118.7 | 69.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | °C/W |