TLV170x 2.2V 至 36V 微功耗比较器
- ZHCSBX7D December 2013 – June 2015 TLV1701 , TLV1702 , TLV1704
  
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TLV170x 2.2V 至 36V 微功耗比较器

本资源的原文使用英文撰写。为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

电源范围：
+2.2V 至 +36V 或 ±1.1V 至 ±18V
低静态电流：
每个比较器 55µA
输入共模范围包括两个电源轨
低传播延迟：560ns
低输入偏移电压：300µV
集电极开路输出：
- 最大可高出负电源 36V 且不受电源电压影响
工业温度范围：
-40°C 至 +125°C
小型封装：
- 单通道：SC70-5、SOT-23-5 和 SOT553-5
- 双通道：VSSOP-8、X2QFN-8
- 四通道：TSSOP-14

2 应用范围

过压和欠压检测器
窗口比较器
过流检测器
零交叉检测器
针对以下应用的系统监控：
- 电源
- 白色家电
- 工业传感器
- 汽车
- 医疗

3 说明

TLV170x 系列器件提供宽电源范围、轨到轨输入、低静态电流和低传播延迟。所有这些特性均符合行业标准，采用极小封装，借此，这些器件得以成为目前市场上可提供的最佳通用比较器。

集电极开路输出具有能够将输出拉至任意电压轨（最大可高出负电源 +36V）的优势，且不受 TLV170x 电源电压影响。

这些器件均可提供单通道 (TLV1701)、双通道 (TLV1702) 和四通道 (TLV1704) 三种版本。低输入偏移电压、低输入偏置电流、低电源电流和开集配置使得 TLV170x 系列能够灵活处理从简单电压检测到驱动单个继电器的大多数应用。

所有器件的额定工作温度均在扩展的工业温度范围 –40°C 到 +125°C 内。

器件信息⁽¹⁾

器件型号	封装	封装尺寸（标称值）
TLV1701	SOT553 (5)	1.20mm × 1.60mm
	SC-70 (5)	1.25mm × 2.00mm
	SOT-23 (5)	1.60mm x 2.90mm
TLV1702	X2QFN (8)	1.50mm x 1.50mm
TLV1702	VSSOP (8)⁽²⁾	3.00mm × 3.00mm
TLV1704	TSSOP (14)	4.40mm × 5.00mm

要了解所有可用封装，请见数据表末尾的封装选项附录。
VSSOP 封装与 MSOP 封装相同。

TLV1702 作为窗口比较器

TLV1701 TLV1702 TLV1704 ai_windowcomp_bos589.gif

稳定传播延迟与温度

TLV1701 TLV1702 TLV1704 C012_SBOS589.png

4 修订历史记录

Changes from C Revision (December 2014) to D Revision

已将文档状态从“混合状态”更改为“量产数据”Go
已将 TLV1702 RUG 封装的状态更改为量产数据Go

Changes from B Revision (October 2014) to C Revision

TLV1701 DCK 封装已从预览更改为量产数据Go
Changed Handling Ratings table to ESD Ratings table, and moved storage temperature to Absolute Maximum Ratings tableGo

Changes from A Revision (September 2014) to B Revision

更改了器件信息表中的脚注 2：已将 TLV1701 添加到可用器件列表中Go
Added TLV1701 to list of production data packages in footnote for the Pin Configuration and Functions section Go
Added TLV1701 row to V_(ESD) parameter in Handling Ratings tableGo

Changes from * Revision (December 2013) to A Revision

已将文档格式更改为符合最新的数据表标准；添加了新章节并移动了现有章节Go
TLV1704 PW (TSSOP-14) 封装已从预览更改为量产数据Go
在集电极开路输出特性中添加了分项Go
在说明部分添加了第二段Go
已从说明部分中删除封装信息；冗余信息Go
Changed Related Products table to Device Comparison table, moved from page 1, and added TLV370x familyGo
Added TLV1701, TLV1702 RUG, and TLV704 package drawingsGo
Added thermal information for TLV1702 RUG, TLV1704 PW, and all TLV1701 packagesGo
Moved switching characteristics parameters from Electrical Characteristics table to new Switching Characteristics tableGo
Changed all typical values in Switching Characteristics tableGo
Changed title for Figure 1Go
Changed Figure 8Go
Changed Figure 9Go
Changed Figure 10Go
Changed Figure 11Go
Changed Figure 12Go
Changed Figure 13Go
Changed Figure 14Go
ChangedApplication Information and moved section Go
Deleted Application Examples sectionGo

5 Device Comparison

DEVICE	FEATURES
TLV3201	40-ns, 40-µA, push-pull comparator
TLV3202	40-ns, 40-µA, push-pull comparator
TLV3501	4.5-ns, rail-to-rail, push-pull, high-speed comparator
TLV3502	4.5-ns, rail-to-rail, push-pull, high-speed comparator
TLV3401	Nanopower open-drain output comparator
TLV3402
TLV3404
TLV3701	Nanopower push-pull output comparator
TLV3702
TLV3704
REF3325	3.9-µA, SC70-3 voltage reference
REF3330
REF3333

6 Pin Configuration and Functions

TLV1701

DBV (SOT-23-5), DCK (SC70-5), DRL (SOT553-5) Packages

Top View

TLV1702

DGK (VSSOP-8) Package

Top View

TLV1702

RUG (X2QFN-8) Package

Top View

TLV1704

PW (TSSOP-14) Package

Top View

TLV1701 TLV1702 TLV1704 ai_pkg_pw_bos589.gif

Pin Functions

PIN				I/O	DESCRIPTION
NAME	NO.
NAME	TLV1701 DBV, DCK, DRL	TLV1702 DGK, RUG	TLV1704 PW
IN+	1	—	—	I	Noninverting input
1IN+	—	3	5	I	Noninverting input, channel 1
2IN+	—	5	7	I	Noninverting input, channel 2
3IN+	—	—	9	I	Noninverting input, channel 3
4IN+	—	—	11	I	Noninverting input, channel 4
IN–	3	—	—	I	Inverting input
1IN–	—	2	4	I	Inverting input, channel 1
2IN–	—	6	6	I	Inverting input, channel 2
3IN–	—	—	8	I	Inverting input, channel 3
4IN–	—	—	10	I	Inverting input, channel 4
OUT	4	—	—	O	Output
1OUT	—	1	2	O	Output, channel 1
2OUT	—	7	1	O	Output, channel 2
3OUT	—	—	14	O	Output, channel 3
4OUT	—	—	13	O	Output, channel 4
V+	5	8	3	—	Positive (highest) power supply
V–	2	4	12	—	Negative (lowest) power supply

7 Specifications

7.1 Absolute Maximum Ratings⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
Supply voltage			+40 (±20)	V
Signal input pins	Voltage⁽²⁾	(V_S–) – 0.5	(V_S+) + 0.5	V
Signal input pins	Current⁽²⁾		±10	mA
Output short-circuit⁽³⁾		Continuous		mA
Operating temperature range		–55	+150	°C
Junction temperature, T_J			150	°C
Storage temperature, T_stg		–65	+150	°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less.

(3) Short-circuit to ground; one comparator per package.

7.2 ESD Ratings

			VALUE	UNIT
TLV1701 and TLV1702
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1500	V
TLV1704
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
Supply voltage V_S = (V_S+) – (V_S–)		2.2 (±1.1)		36 (±18)	V
Specified temperature		–40		125	°C

7.4 Thermal Information: TLV1701

THERMAL METRIC⁽¹⁾		TLV1701			UNIT
		DRL (SOT553)	DCK (SC70)	DBV (SOT23)
		5 PINS	5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	271.5	283.6	233.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	115.6	94.1	156.4	°C/W
R_θJB	Junction-to-board thermal resistance	89.7	61.3	60.6	°C/W
ψ_JT	Junction-to-top characterization parameter	17.6	1.9	35.7	°C/W
ψ_JB	Junction-to-board characterization parameter	89.2	60.5	59.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Thermal Information: TLV1702 and TLV1704

THERMAL METRIC⁽¹⁾		TLV1702		TLV1704	UNIT
		RUG (QFN)	DGK (VSSOP)	PW (TSSOP)
		8 PINS	8 PINS	14 PINS
θ_JA	Junction-to-ambient thermal resistance	205.6	199	128.1	°C/W
θ_JCtop	Junction-to-case (top) thermal resistance	77.1	89.5	56.5	°C/W
θ_JB	Junction-to-board thermal resistance	107.0	120.4	69.9	°C/W
ψ_JT	Junction-to-top characterization parameter	2.0	22.0	9.1	°C/W
ψ_JB	Junction-to-board characterization parameter	107.0	118.7	69.3	°C/W
θ_JCbot	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

7.6 Electrical Characteristics

at T_A = +25°C, V_S = +2.2 V to +36 V, C_L = 15 pF, R_PULLUP = 5.1 kΩ, V_CM = V_S / 2, and V_S = V_PULLUP (unless otherwise noted)

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
OFFSET VOLTAGE
V_OS	Input offset voltage	T_A = 25°C, V_S = 2.2 V		±0.5	±3.5	mV
		T_A = 25°C, V_S = 36 V		±0.3	±2.5	mV
		T_A = –40°C to +125°C			±5.5	mV
dV_OS/dT	Input offset voltage drift	T_A = –40°C to +125°C		±4	±20	μV/°C
PSRR	Power-supply rejection ratio			15	100	μV/V
PSRR	Power-supply rejection ratio	T_A = –40°C to +125°C		20		μV/V
INPUT VOLTAGE RANGE
V_CM	Common-mode voltage range	T_A = –40°C to +125°C	(V–)		(V+)	V
INPUT BIAS CURRENT
I_B	Input bias current			5	15	nA
I_B	Input bias current	T_A = –40°C to +125°C			20	nA
I_OS	Input offset current			0.5		nA
C_LOAD	Capacitive load drive		See Typical Characteristics
OUTPUT
V_O	Voltage output swing from rail	I_O ≤ 4 mA, input overdrive = 100 mV, V_S = 36 V			900	mV
V_O	Voltage output swing from rail	I_O = 0 mA, input overdrive = 100 mV, V_S = 36 V			600	mV
I_SC	Short circuit sink current			20		mA
	Output leakage current	V_IN+ > V_IN–		70		nA
POWER SUPPLY
V_S	Specified voltage range		2.2		36	V
I_Q	Quiescent current (per channel)	I_O = 0 A		55	75	μA
I_Q	Quiescent current (per channel)	I_O = 0 A, T_A = –40°C to +125°C			100	μA

7.7 Switching Characteristics

at T_A = +25°C, V_S = +2.2 V to +36 V, C_L = 15 pF, R_PULLUP = 5.1 kΩ, V_CM = V_S / 2, and V_S = V_PULLUP (unless otherwise noted)

PARAMETER		TEST CONDITIONS	TYP	UNIT
t_pHL	Propagation delay time, high-to-low	Input overdrive = 100 mV	460	ns
t_pLH	Propagation delay time, low-to-high	Input overdrive = 100 mV	560	ns
t_R	Rise time	Input overdrive = 100 mV	365	ns
t_F	Fall time	Input overdrive = 100 mV	240	ns

7.8 Typical Characteristics

at T_A = +25°C, V_S = +5 V, R_PULLUP = 5.1 kΩ, and input overdrive = 100 mV (unless otherwise noted)

TLV1701 TLV1702 TLV1704 C017_SBOS589.png

Figure 1. Quiescent Current vs Temperature

TLV1701 TLV1702 TLV1704 C014_SBOS589.png

Figure 3. Input Offset Current vs Temperature

TLV1701 TLV1702 TLV1704 C003_SBOS589.png

Figure 5. Offset Voltage vs Common-Mode Voltage

TLV1701 TLV1702 TLV1704 C001_SBOS589.png

Figure 7. Offset Voltage vs Supply Voltage

TLV1701 TLV1702 TLV1704 C006_SBOS589.png

Figure 9. Propagation Delay vs Capacitive Load

TLV1701 TLV1702 TLV1704 C007_SBOS589.png

Figure 11. Propagation Delay (T_pLH)

TLV1701 TLV1702 TLV1704 C009_SBOS589.png

Figure 13. Propagation Delay (T_pLH)

TLV1701 TLV1702 TLV1704 C005_SBOS589.png

Figure 15. Offset Voltage Production Distribution

TLV1701 TLV1702 TLV1704 C016_SBOS589.png

Figure 17. Short-Circuit Current vs Supply Voltage

TLV1701 TLV1702 TLV1704 C015_SBOS589.png

Figure 2. Input Bias Current vs Temperature

TLV1701 TLV1702 TLV1704 C011_SBOS589.png

Figure 4. Output Voltage vs Output Current

TLV1701 TLV1702 TLV1704 C002_SBOS589.png

Figure 6. Offset Voltage vs Common-Mode Voltage

TLV1701 TLV1702 TLV1704 C013_SBOS589.png

Figure 8. Propagation Delay vs Input Overdrive

Figure 10. Propagation Delay vs Temperature

TLV1701 TLV1702 TLV1704 C008_SBOS589.png

Figure 12. Propagation Delay (T_pHL)

TLV1701 TLV1702 TLV1704 C010_SBOS589.png

Figure 14. Propagation Delay (T_pHL)

TLV1701 TLV1702 TLV1704 C004_SBOS589.png

Figure 16. Offset Voltage Production Distribution

8 Detailed Description

8.1 Overview

The TLV170x comparators features rail-to-rail input and output on supply voltages as high as 36 V. The rail-to-rail input stage enables detection of signals close to the supply and ground. The open collector configuration allows the device to be used in wired-OR configurations, such as a window comparator. A low supply current of 55 μA per channel with small, space-saving packages, makes these comparators versatile for use in a wide range of applications, from portable to industrial.

8.2 Functional Block Diagram

TLV1701 TLV1702 TLV1704 TLV1701_Simplified.gif

8.3 Feature Description

8.3.1 Comparator Inputs

The TLV170x are rail-to-rail input comparators, with an input common-mode range that includes the supply rails. The TLV170x is designed to prevent phase inversion when the input pins exceed the supply voltage. Figure 18 shows the TLV170x response when input voltages exceed the supply, resulting in no phase inversion.

TLV1701 TLV1702 TLV1704 C018_SBOS589.png

Figure 18. No Phase Inversion: Comparator Response to Input Voltage
(Propagation Delay Included)

8.4 Device Functional Modes

8.4.1 Setting Reference Voltage

Using a stable reference is important when setting the transition point for the TLV170x. The REF3333, as shown in Figure 19, provides a 3.3-V reference voltage with low drift and only 3.9 μA of quiescent current.

TLV1701 TLV1702 TLV1704 ai_refvoltage_bos589.gif

Figure 19. Reference Voltage for the TLV170x