ZHCSLV0C September 2022 – September 2023 TLV1811 , TLV1812 , TLV1814 , TLV1821 , TLV1822 , TLV1824
PRODMIX
THERMAL METRIC(1) | TLV18x1 and TLV18x1L | UNIT | |||
---|---|---|---|---|---|
DCK (SC-70) | DCK (SC-70) | DBV (SOT-23) | |||
5 PINS | 6 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 226.6 | 185.6 | 203.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 129.5 | 137.6 | 105.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 78.6 | 76.5 | 106.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 51.5 | 59.8 | 54.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 78.3 | 76.2 | 106 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | – | °C/W |