SNOSDJ3 May   2024 TLV1812-EP

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5.   Pin Configuration and Functions
  6. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Thermal Information - EP
    4. 4.4 Recommended Operating Conditions
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Typical Characteristics
  7. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagrams
    3. 5.3 Feature Description
    4. 5.4 Device Functional Modes
      1. 5.4.1 Inputs
        1. 5.4.1.1 TLV18x2-EP Rail-to-Rail Input
        2. 5.4.1.2 ESD Protection
        3. 5.4.1.3 Unused Inputs
      2. 5.4.2 Outputs
        1. 5.4.2.1 TLV1812-EP Push-Pull Output
        2. 5.4.2.2 TLV1822-EP Open-Drain Output
      3. 5.4.3 Power-On Reset (POR)
      4. 5.4.4 Hysteresis
  8. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Basic Comparator Definitions
        1. 6.1.1.1 Operation
        2. 6.1.1.2 Propagation Delay
        3. 6.1.1.3 Overdrive Voltage
      2. 6.1.2 Hysteresis
        1. 6.1.2.1 Inverting Comparator With Hysteresis
        2. 6.1.2.2 Non-Inverting Comparator With Hysteresis
        3. 6.1.2.3 Inverting and Non-Inverting Hysteresis using Open-Drain Output
    2. 6.2 Typical Applications
      1. 6.2.1 Window Comparator
        1. 6.2.1.1 Design Requirements
        2. 6.2.1.2 Detailed Design Procedure
        3. 6.2.1.3 Application Curve
      2. 6.2.2 Square-Wave Oscillator
        1. 6.2.2.1 Design Requirements
        2. 6.2.2.2 Detailed Design Procedure
        3. 6.2.2.3 Application Curve
      3. 6.2.3 Adjustable Pulse Width Generator
      4. 6.2.4 Time Delay Generator
      5. 6.2.5 Logic Level Shifter
      6. 6.2.6 One-Shot Multivibrator
      7. 6.2.7 Bi-Stable Multivibrator
      8. 6.2.8 Zero Crossing Detector
      9. 6.2.9 Pulse Slicer
    3. 6.3 Power Supply Recommendations
    4. 6.4 Layout
      1. 6.4.1 Layout Guidelines
      2. 6.4.2 Layout Example
  9. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.3 Thermal Information - EP

THERMAL METRIC(1) TLV1812-EP UNIT
DDF (SOT-23)
8 PINS
RθJA Junction-to-ambient thermal resistance 170.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.3 °C/W
RθJB Junction-to-board thermal resistance 88.1 °C/W
ψJT Junction-to-top characterization parameter 7.5 °C/W
ψJB Junction-to-board characterization parameter 87.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |