SNOSDE7B December   2022  – September 2024 TLV1851 , TLV1852 , TLV1854 , TLV1861 , TLV1862 , TLV1864

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Configuration: TLV1831 and TLV1841
    2.     Pin Configurations: TLV1852 and TLV1862
    3.     Pin Configurations: TLV1854 and TLV1864
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
        1. 6.4.1.1 Operating Common-Mode Ranges
        2. 6.4.1.2 Fail-Safe Inputs
        3. 6.4.1.3 Unused Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Outputs
        1. 6.4.3.1 TLV185x Push-Pull Output
        2. 6.4.3.2 TLV186x Open-Drain Output
      4. 6.4.4 ESD Protection
        1. 6.4.4.1 Inputs
        2. 6.4.4.2 Outputs
      5. 6.4.5 Power-On Reset (POR)
      6. 6.4.6 Reverse Battery Protection
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
        3. 7.1.2.3 Inverting and Non-Inverting Hysteresis using Open-Drain Output
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Undervoltage Detection
      3. 7.2.3 Reverse Battery and Overvoltage Protection Scheme
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Thermal Information

THERMAL METRIC(1) TLV185x/6x UNIT
DBV
(SOT-23)		 DGK
(VSSOP)		 PW
(TSSOP)
5 Pins 8 Pins 14 Pins
RqJA Junction-to-ambient thermal resistance 168.1 163.1 94.2 °C/W
RqJC(top) Junction-to-case (top) thermal resistance 68.1 55.5 29 °C/W
RqJB Junction-to-board thermal resistance 37.4 84.7 51.8 °C/W
yJT Junction-to-top characterization parameter 11.4 5.7 1.3 °C/W
yJB Junction-to-board characterization parameter 37.1 83.1 51.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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