7.1 Overview

The TLVx197-Q1 family of e-trim™ operational amplifiers uses a method of package-level trim for offset and offset temperature drift implemented during the final steps of manufacturing after the plastic molding process. This method minimizes the influence of inherent input transistor mismatch, as well as errors induced during package molding. The trim communication occurs on the output pin of the standard pinout, and after the trim points are set, further communication to the trim structure is permanently disabled. The Functional Block Diagram shows the simplified diagram of the TLVx197-Q1 e-trim operational amplifier.

Unlike previous e-trim op amps, the TLVx197-Q1 uses a patented two-temperature trim architecture to achieve a low offset voltage of 500 µV (maximum), and low voltage offset drift of 5 µV/°C (maximum) over the full specified temperature range. This level of precision performance at wide supply voltages makes these amplifiers useful for high-impedance industrial sensors, filters, and high-voltage data acquisition.