SLAS548D October   2008  – September 2015 TLV320ADC3001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Dissipation Ratings
    7. 8.7  I2S/LJF/RJF Timing in Master Mode
    8. 8.8  DSP Timing in Master Mode
    9. 8.9  I2S/LJF/RJF Timing in Slave Mode
    10. 8.10 DSP Timing in Slave Mode
    11. 8.11 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Hardware Reset
      2. 10.3.2  PLL Start-up
      3. 10.3.3  Software Power Down
      4. 10.3.4  miniDSP
      5. 10.3.5  Audio Data Converters
      6. 10.3.6  Digital Audio Data Serial Interface
        1. 10.3.6.1 Right-Justified Mode
        2. 10.3.6.2 Left-Justified Mode
        3. 10.3.6.3 I2S Mode
        4. 10.3.6.4 DSP Mode
      7. 10.3.7  Audio Clock Generation
      8. 10.3.8  Stereo Audio ADC
      9. 10.3.9  Audio Analog Inputs
        1. 10.3.9.1 Digital Volume Control
        2. 10.3.9.2 Fine Digital Gain Adjustment
        3. 10.3.9.3 AGC
      10. 10.3.10 Input Impedance and VCM Control
      11. 10.3.11 MICBIAS Generation
      12. 10.3.12 ADC Decimation Filtering and Signal Processing
        1. 10.3.12.1 Processing Blocks
        2. 10.3.12.2 Processing Blocks - Details
          1. 10.3.12.2.1 First-Order IIR, AGC, Filter A
          2. 10.3.12.2.2 Five Biquads, First-Order IIR, AGC, Filter A
          3. 10.3.12.2.3 25-Tap FIR, First-Order IIR, AGC, Filter A
          4. 10.3.12.2.4 First-Order IIR, AGC, Filter B
          5. 10.3.12.2.5 Three Biquads, First-Order IIR, AGC, Filter B
          6. 10.3.12.2.6 20-Tap FIR, First-Order IIR, AGC, Filter B
          7. 10.3.12.2.7 First-Order IIR, AGC, Filter C
          8. 10.3.12.2.8 Five Biquads, First-Order IIR, AGC, Filter C
          9. 10.3.12.2.9 25-Tap FIR, First-Order IIR, AGC, Filter C
        3. 10.3.12.3 User-Programmable Filters
          1. 10.3.12.3.1 First-Order IIR Section
          2. 10.3.12.3.2 Biquad Section
          3. 10.3.12.3.3 FIR Section
        4. 10.3.12.4 Decimation Filter
          1. 10.3.12.4.1 Decimation Filter A
          2. 10.3.12.4.2 Decimation Filter B
          3. 10.3.12.4.3 Decimation Filter C
    4. 10.4 Device Functional Modes
      1. 10.4.1 Recording Mode
    5. 10.5 Programming
      1. 10.5.1 Digital Interfaces
        1. 10.5.1.1 I2C Control Mode
    6. 10.6 Register Maps
      1. 10.6.1 Control Registers
      2. 10.6.2 Control Registers, Page 0: Clock Multipliers and Dividers, Serial Interfaces, Flags, Interrupts and Programming of GPIOs
      3. 10.6.3 CONTROL REGISTERS Page 1: ADC Routing, PGA, Power-Controls, Etc.
      4. 10.6.4 Control Registers, Page 4: ADC Digital Filter Coefficients
      5. 10.6.5 Control Registers, Page 5: ADC Programmable Coefficients RAM (65:127)
      6. 10.6.6 Control Registers, Page 32: ADC DSP Engine Instruction RAM (0:31)
        1. 10.6.6.1 Page 32 / Register 5 Through Page 32 / Register 97
      7. 10.6.7 Control Registers, Page 33 Through Page 47: ADC DSP Engine Instruction RAM (32:63) Through (480:511)
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 ADC Setup
          1. 11.2.2.1.1 Step 1
          2. 11.2.2.1.2 Step 2
          3. 11.2.2.1.3 Example Register Setup to Record Analog Data Through ADC to Digital Out
        2. 11.2.2.2 MICBIAS
        3. 11.2.2.3 Decoupling Capacitors
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AVDD to AVSS –0.3 3.9 V
IOVDD to DVSS –0.3 3.9 V
DVDD to DVSS –0.3 2.5 V
Digital input voltage to DVSS –0.3 IOVDD + 0.3 V
Analog input voltage to AVSS –0.3 AVDD + 0.3 V
Operating temperature –40 85 °C
TJ Max Junction temperature 105 °C
Power dissipation (TJ Max – TA) / θJA W
Tstg Storage temperature –65 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
AVDD(1) Analog supply voltage 2.6 3.3 3.6 V
DVDD(1) Digital core supply voltage 1.65 1.8 1.95 V
IOVDD(1) Digital I/O supply voltage 1.1 1.8 3.6 V
VI Analog full-scale 0-dB input voltage (AVDD = 3.3 V) 0.707 Vrms
Digital output load capacitance 10 pF
TA Operating free-air temperature –40 85 °C
(1) Analog voltage values are with respect to AVSS; digital voltage values are with respect to DVSS.

8.4 Thermal Information

THERMAL METRIC(1) TLV320ADC3001 UNIT
YZH (DSBGA)
16 PINS
RθJA Junction-to-ambient thermal resistance 70.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.3 °C/W
RθJB Junction-to-board thermal resistance 13.7 °C/W
ψJT Junction-to-top characterization parameter 1.7 °C/W
ψJB Junction-to-board characterization parameter 13.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

8.5 Electrical Characteristics

At 25°C, AVDD = 3.3 V, IOVDD = 1.8 V, DVDD = 1.8 V, fS = 48-kHz, 16-bit audio data (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AUDIO ADC
Input signal level (0-dB) Single-ended input 0.707 Vrms
Input common-mode voltage Single-ended input 1.35 Vrms
Signal-to-noise ratio,
A-weighted(1)(2)		 fS = 48 kHz, 0-dB PGA gain, IN1 inputs selected
and AC-shorted to ground		 80 92 dB
Dynamic range,
A-weighted(1)(2)		 fS = 48 kHz, 1-kHz –60-dB full-scale input applied at IN1 inputs, 0-dB PGA gain 92 dB
THD Total harmonic distortion fS = 48 kHz, 1-kHz –2-dB full-scale input applied at IN1
inputs, 0-dB PGA gain		 –90 –75 dB
0.003% 0.017%
Power-supply rejection ratio 234 Hz, 100 mVPP on AVDD, single-ended input 46 dB
234 Hz, 100 mVPP on AVDD, differential input 68
ADC channel separation 1 kHz, –2 dB IN1L to IN1R –73 dB
ADC gain error 1-kHz input, 0-dB PGA gain 0.7 dB
ADC programmable-gain amplifier maximum gain 1-kHz input tone, RSOURCE < 50 Ω 40 dB
ADC programmable-gain amplifier step size 0.502 dB
Input resistance IN1 inputs, routed to single ADC
Input mix attenuation = 0 dB		 35 kΩ
IN2 inputs, input mix attenuation = 0 dB 35
IN1 inputs, input mix attenuation = –6 dB 62.5
IN2 inputs, input mix attenuation = –6 dB 62.5
Input capacitance 10 pF
Input level control minimum attenuation setting 0 dB
Input level control maximum attenuation setting 6 dB
Input level control attenuation step size 6 dB
ADC DIGITAL DECIMATION FILTER fS = 48 kHz
Filter gain from 0 to 0.39 fS Filter A, AOSR = 128 or 64 ±0.1 dB
Filter gain from 0.55 fS to 64 fS Filter A, AOSR = 128 or 64 –73 dB
Filter group delay Filter A, AOSR = 128 or 64 17/fS s
Filter gain from 0 to 0.39 fS Filter B, AOSR = 64 ±0.1 dB
Filter gain from 0.60 fS to 32 fS Filter B, AOSR = 64 -46 dB
Filter group delay Filter B, AOSR = 64 11/fS s
Filter gain from 0 to 0.39 fS Filter C, AOSR = 32 ±0.033 dB
Filter gain from 0.28 fS to 16 fS Filter C, AOSR = 32 -60 dB
Filter group delay Filter C, AOSR = 32 11/fS s
MICROPHONE BIAS
Bias voltage Programmable settings, load = 750 Ω 2 V
2.25 2.5 2.75
AVDD – 0.2
Current sourcing 2.5 V setting 4 mA
Integrated noise BW = 20 Hz to 20 kHz, A-weighted, 1-µF capacitor between MICBIAS and AGND 3.3 µVrms
DIGITAL I/O
VIL Input low level IIL = 5 μA –0.3 0.3 × IOVDD V
VIH Input high level(3) IIH = 5 μA 0.7 × IOVDD V
VOL Output low level IIH = 2 TTL loads 0.1 × IOVDD V
VOH Output high level IOH = 2 TTL loads 0.8 × IOVDD V
SUPPLY CURRENT fS = 48 kHz, AVDD = 3.3 V, DVDD = IOVDD = 1.8 V
Mono record AVDD PLL and AGC off 2 mA
DVDD 1.9
Stereo record AVDD PLL and AGC off 4 mA
DVDD 2.1
PLL AVDD Additional power consumed when PLL is powered 1.1 mA
DVDD 0.8
Power down AVDD All supply voltages applied, all blocks programmed in lowest power state 0.04 μA
DVDD 0.7
(1) Ratio of output level with 1-kHz full-scale sine-wave input, to the output level with the inputs short-circuited, measured A-weighted over a 20-Hz to 20-kHz bandwidth using an audio analyzer.
(2) All performance measurements done with 20-kHz lowpass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The lowpass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
(3) When IOVDD < 1.6 V, minimum VIH is 1.1 V.

8.6 Dissipation Ratings(1)

PACKAGE TYPE TA = 25°C
POWER RATING 		DERATING FACTOR TA = 75°C
POWER RATING		 TA = 85°C
POWER RATING
DSBGA 1052.6 mW 13.1 mW/°C 394.7 mW 263.2 mW
(1) This data was taken using 2 oz. (0.071-mm thick) trace and copper pad that is soldered directly to a JEDEC standard 4-layer 3-in. × 3-in. (7.62-cm × 7.62-cm) PCB.

8.7 I2S/LJF/RJF Timing in Master Mode

Specified at 25°C, DVDD = 1.8 V. All timing specifications are measured at characterization. See Figure 1 for timing diagram.
IOVDD = 1.8 V IOVDD = 3.3 V UNIT
MIN MAX MIN MAX
td(WS) BCLK/WCLK delay time 20 15 ns
td(DO-WS) BCLK/WCLK to DOUT delay time 25 20 ns
td(DO-BCLK) BCLK to DOUT delay time 20 15 ns
tr Rise time 20 15 ns
tf Fall time 20 15 ns

8.8 DSP Timing in Master Mode

Specified at 25°C, DVDD = 1.8 V. All timing specifications are measured at characterization. See Figure 2 for timing diagram.
IOVDD = 1.8 V IOVDD = 3.3 V UNIT
MIN MAX MIN MAX
td(WS) BCLK/WCLK delay time 25 15 ns
td(DO-BCLK) BCLK to DOUT delay time 25 15 ns
tr Rise time 20 15 ns
tf Fall time 20 15 ns

8.9 I2S/LJF/RJF Timing in Slave Mode

Specified at 25°C, DVDD = 1.8 V. All timing specifications are measured at characterization. See Figure 3 for timing diagram.
IOVDD = 1.8 V IOVDD = 3.3 V UNIT
MIN MAX MIN MAX
tH(BCLK) BCLK high period 35 35 ns
tL(BCLK) BCLK low period 35 35 ns
ts(WS) BCLK/WCLK setup time 10 6 ns
th(WS) BCLK/WCLK hold time 10 6 ns
td(DO-WS) BCLK/WCLK to DOUT delay time (for LJF Mode only) 30 30 ns
td(DO-BCLK) BCLK to DOUT delay time 25 20 ns
tr Rise time 16 8 ns
tf Fall time 16 8 ns

8.10 DSP Timing in Slave Mode

Specified at 25°C, DVDD = 1.8 V. All timing specifications are measured at characterization. See Figure 4 for timing diagram.
IOVDD = 1.8 V IOVDD = 3.3 V UNIT
MIN MAX MIN MAX
tH(BCLK) BCLK high period 35 35 ns
tL(BCLK) BCLK low period 35 35 ns
ts(WS) BCLK/WCLK setup time 10 8 ns
th(WS) BCLK/WCLK hold time 10 8 ns
td(DO-BCLK) BCLK to DOUT delay time 25 20 ns
tr Rise time 15 8 ns
tf Fall time 15 8 ns
TLV320ADC3001 ljf_time_mm_las553.gifFigure 1. I2S/LJF/RJF Timing in Master Mode
TLV320ADC3001 dsp_time_mm_las553.gifFigure 2. DSP Timing in Master Mode
TLV320ADC3001 ljf_time_sm_las553.gifFigure 3. I2S/LJF/RJF Timing in Slave Mode
TLV320ADC3001 dsp_slave_las553.gif
Note A. Falling edge inside a frame for WCLK is arbitrary inside frame.
Figure 4. DSP Timing in Slave Mode

8.11 Typical Characteristics

TLV320ADC3001 ge_pga_las548.gif
Figure 5. Single-Ended Gain Error
TLV320ADC3001 bias2_las548.gif
Figure 7. MICBIAS Output Voltage vs Ambient Temperature
TLV320ADC3001 noise_g_las553.gif
Figure 9. Input-Referred Noise vs PGA Gain
TLV320ADC3001 mic2a_las548.gif
Figure 6. MICBIAS Output Voltage vs AVDD
TLV320ADC3001 dacline2_las479.gif
Figure 8. Line Input to ADC FFT Plot
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