ZHCSHY2 March 2018 TLV320ADC3100
PRODUCTION DATA.
THERMAL METRIC(1) | TLV320ADC3100 | UNIT | |
---|---|---|---|
RGE (VQFN) | |||
24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 33.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 34.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 11.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.2 | °C/W |