ZHCSJS1E September   2008  – September 2019 TLV320AIC3204

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 描述
    1.     Device Images
      1.      简化方框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics, ADC
    6. 7.6  Electrical Characteristics, Bypass Outputs
    7. 7.7  Electrical Characteristics, Microphone Interface
    8. 7.8  Electrical Characteristics, Audio DAC Outputs
    9. 7.9  Electrical Characteristics, LDO
    10. 7.10 Electrical Characteristics, Misc.
    11. 7.11 Electrical Characteristics, Logic Levels
    12. 7.12 I2S LJF and RJF Timing in Master Mode (see )
    13. 7.13 I2S LJF and RJF Timing in Slave Mode (see )
    14. 7.14 DSP Timing in Master Mode (see )
    15. 7.15 DSP Timing in Slave Mode (see )
    16. 7.16 Digital Microphone PDM Timing (see )
    17. 7.17 I2C Interface Timing
    18. 7.18 SPI Interface Timing (See )
    19. 7.19 Typical Characteristics
    20. 7.20 Typical Characteristics, FFT
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Device Connections
        1. 9.3.1.1 Digital Pins
          1. 9.3.1.1.1 Multifunction Pins
        2. 9.3.1.2 Analog Pins
      2. 9.3.2 Analog Audio IO
        1. 9.3.2.1 Analog Low Power Bypass
        2. 9.3.2.2 ADC Bypass Using Mixer Amplifiers
        3. 9.3.2.3 Headphone Outputs
        4. 9.3.2.4 Line Outputs
      3. 9.3.3 ADC
        1. 9.3.3.1 ADC Processing
          1. 9.3.3.1.1 ADC Processing Blocks
      4. 9.3.4 DAC
        1. 9.3.4.1 DAC Processing Blocks
      5. 9.3.5 PowerTune
      6. 9.3.6 Digital Audio IO Interface
      7. 9.3.7 Clock Generation and PLL
      8. 9.3.8 Control Interfaces
        1. 9.3.8.1 I2C Control
        2. 9.3.8.2 SPI Control
    4. 9.4 Device Functional Modes
    5. 9.5 Register Map
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Reference Filtering Capacitor
        2. 10.2.1.2 MICBIAS
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Analog Input Connection
        2. 10.2.2.2 Analog Output Connection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from D Revision (May 2019) to E Revision

  • Added BCLK to rise and fall time parameter names in I2S LJF and RJF Timing in Master Mode tableGo
  • Added BCLK to rise and fall time parameter names in I2S LJF and RJF Timing in Slave Mode tableGo
  • Added BCLK to rise and fall time parameter names in DSP Timing in Master Mode tableGo
  • Added BCLK to rise and fall time parameter names in DSP Timing in Slave Mode tableGo
  • Added CLK to rise and fall time parameter names in Digital Microphone PDM Timing tableGo

Changes from C Revision (November 2014) to D Revision

  • Changed ESD Ratings title and format to current standards Go
  • Added footnote to I2S LJF and RJF Timing in Slave Mode tableGo
  • Added footnote to DSP Timing in Slave Mode tableGo

Changes from B Revision (October 2012) to C Revision

  • 的立体声音频 DAC添加了“器件信息”表、“处理额定值”表、 “应用 和实施”部分，“布局”部分以及“器件和文档支持”部分Go
  • Changed the pin description From: connect to DVss. To: D-LDO enable signalGo
  • Added "DVDD" to LDOs disabled in operating conditions statementGo
  • Added "Audio input max ac signal swing" to the Recommended Operating Conditions tableGo
  • Added the Digital Microphone PDM Timing (see ) sectionGo
  • Corrected thi to th(DIN)Go
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