ZHCS851A March   2012  – September 2015 TLV320AIC3212

PRODUCTION DATA.  

1. 1 特性
2. 2 应用范围
3. 3 描述
4. 4 修订历史记录
5. 5 说明 （续）
6. 6 Device Comparison Table
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Thermal Information
   5. 8.5  Electrical Characteristics, SAR ADC
   6. 8.6  Electrical Characteristics, ADC
   7. 8.7  Electrical Characteristics, Bypass Outputs
   8. 8.8  Electrical Characteristics, Microphone Interface
   9. 8.9  Electrical Characteristics, Audio DAC Outputs
   10. 8.10 Electrical Characteristics, Class-D Outputs
   11. 8.11 Electrical Characteristics, Miscellaneous
   12. 8.12 Electrical Characteristics, Logic Levels
   13. 8.13 Audio Data Serial Interface Timing (I2S): I2S/LJF/RJF Timing in Master Mode
   14. 8.14 Audio Data Serial Interface Timing (I2S): I2S/LJF/RJF Timing in Slave Mode
   15. 8.15 Typical DSP Timing: DSP/Mono PCM Timing in Master Mode
   16. 8.16 Typical DSP Timing: DSP/Mono PCM Timing in Slave Mode
   17. 8.17 I2C Interface Timing
   18. 8.18 SPI Timing
   19. 8.19 Typical Characteristics
       1. 8.19.1 Audio ADC Performance
       2. 8.19.2 Audio DAC Performance
       3. 8.19.3 Class-D Driver Performance
       4. 8.19.4 MICBIAS Performance
9. 9 Parameter Measurement Information
10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
       1. 10.3.1 Device Connections
          1. 10.3.1.1 Digital Pins
          2. 10.3.1.2 Analog Pins
          3. 10.3.1.3 Multifunction Pins
       2. 10.3.2 Analog Audio I/O
          1. 10.3.2.1 Analog Low Power Bypass
          2. 10.3.2.2 Headphone Outputs
             1. 10.3.2.2.1 Using the Headphone Amplifier
             2. 10.3.2.2.2 Ground-Centered Headphone Amplifier Configuration
                1. 10.3.2.2.2.1 Circuit Topology
                2. 10.3.2.2.2.2 Charge Pump Setup and Operation
                3. 10.3.2.2.2.3 Output Power Optimization
                4. 10.3.2.2.2.4 Offset Correction and Start-Up
                5. 10.3.2.2.2.5 Ground-Centered Headphone Setup
                   1. 10.3.2.2.2.5.1 High Audio Output Power, High Performance Setup
                   2. 10.3.2.2.2.5.2 High Audio Output Power, Low Power Consumption Setup
                   3. 10.3.2.2.2.5.3 Medium Audio Output Power, High Performance Setup
                   4. 10.3.2.2.2.5.4 Lowest Power Consumption, Medium Audio Output Power Setup
             3. 10.3.2.2.3 Stereo Unipolar Configuration
                1. 10.3.2.2.3.1 Circuit Topology
                2. 10.3.2.2.3.2 Unipolar Turn-On Transient (Pop) Reduction
             4. 10.3.2.2.4 Mono Differential DAC to Mono Differential Headphone Output
          3. 10.3.2.3 Stereo Line Outputs
             1. 10.3.2.3.1 Line Out Amplifier Configurations
          4. 10.3.2.4 Differential Receiver Output
          5. 10.3.2.5 Stereo Class-D Speaker Outputs
       3. 10.3.3 ADC / Digital Microphone Interface
          1. 10.3.3.1 ADC Processing Blocks — Overview
             1. 10.3.3.1.1 ADC Processing Blocks
       4. 10.3.4 DAC
          1. 10.3.4.1 DAC Processing Blocks — Overview
             1. 10.3.4.1.1 DAC Processing Blocks
       5. 10.3.5 Device Power Consumption
       6. 10.3.6 Powertune
       7. 10.3.7 Clock Generation and PLL
       8. 10.3.8 Interfaces
          1. 10.3.8.1 Control Interfaces
             1. 10.3.8.1.1 I2C Control
             2. 10.3.8.1.2 SPI Control
          2. 10.3.8.2 Digital Audio Interfaces
       9. 10.3.9 Device Special Functions
    4. 10.4 Device Functional Modes
       1. 10.4.1 Recording Mode
       2. 10.4.2 Playback Mode
       3. 10.4.3 Analog Low Power Bypass Modes
    5. 10.5 Register Maps
11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
       1. 11.2.1 Design Requirements
       2. 11.2.2 Detailed Design Procedure
          1. 11.2.2.1 Charge Pump Flying and Holding Capacitor
          2. 11.2.2.2 Reference Filtering Capacitor
          3. 11.2.2.3 MICBIAS
       3. 11.2.3 Application Curves
12. 12Power Supply Recommendations
13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Examples
14. 14器件和文档支持
    1. 14.1 文档支持
       1. 14.1.1 相关文档　
    2. 14.2 社区资源
    3. 14.3 商标
    4. 14.4 静电放电警告
    5. 14.5 Glossary
15. 15机械、封装和可订购信息