ZHCS986B May   2012  – December 2018 TLV320DAC3203

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 描述
    1.     Device Images
      1.      简化方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, Bypass Outputs
    6. 6.6  Electrical Characteristics, Microphone Interface
    7. 6.7  Electrical Characteristics, Audio Outputs
    8. 6.8  Electrical Characteristics, LDO
    9. 6.9  Electrical Characteristics, Misc.
    10. 6.10 Electrical Characteristics, Logic Levels
    11. 6.11 Typical Timing Characteristics — Audio Data Serial Interface Timing (I2S)
    12. 6.12 Typical DSP Timing Characteristics
    13. 6.13 I2C Interface Timing
    14. 6.14 SPI Interface Timing (See )
    15. 6.15 Typical Characteristics
      1. 6.15.1 Typical Characteristics, FFT
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Connections
        1. 7.3.1.1 Digital Pins
          1. 7.3.1.1.1 Multifunction Pins
        2. 7.3.1.2 Analog Pins
      2. 7.3.2 Analog Audio I/O
        1. 7.3.2.1 Analog Low Power Bypass
        2. 7.3.2.2 Headphone Outputs
      3. 7.3.3 Digital Microphone Inteface
        1. 7.3.3.1 ADC Processing Blocks — Overview
          1. 7.3.3.1.1 Processing Blocks
      4. 7.3.4 DAC
        1. 7.3.4.1 DAC Processing Blocks — Overview
      5. 7.3.5 Powertune
      6. 7.3.6 Digital Audio I/O Interface
      7. 7.3.7 Clock Generation and PLL
      8. 7.3.8 Control Interfaces
        1. 7.3.8.1 I2C Control
        2. 7.3.8.2 SPI Control
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TLV320DAC3203 UNIT
YZK (DSBGA) RGE (VQFN)
25 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 57.6 34.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.3 26.6 °C/W
RθJB Junction-to-board thermal resistance 13.7 12.5 °C/W
ψJT Junction-to-top characterization parameter 0.1 0.3 °C/W
ψJB Junction-to-board characterization parameter 13.7 12.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 2.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |