ZHCS986B May   2012  – December 2018 TLV320DAC3203

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 描述
    1.     Device Images
      1.      简化方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, Bypass Outputs
    6. 6.6  Electrical Characteristics, Microphone Interface
    7. 6.7  Electrical Characteristics, Audio Outputs
    8. 6.8  Electrical Characteristics, LDO
    9. 6.9  Electrical Characteristics, Misc.
    10. 6.10 Electrical Characteristics, Logic Levels
    11. 6.11 Typical Timing Characteristics — Audio Data Serial Interface Timing (I2S)
    12. 6.12 Typical DSP Timing Characteristics
    13. 6.13 I2C Interface Timing
    14. 6.14 SPI Interface Timing (See )
    15. 6.15 Typical Characteristics
      1. 6.15.1 Typical Characteristics, FFT
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Connections
        1. 7.3.1.1 Digital Pins
          1. 7.3.1.1.1 Multifunction Pins
        2. 7.3.1.2 Analog Pins
      2. 7.3.2 Analog Audio I/O
        1. 7.3.2.1 Analog Low Power Bypass
        2. 7.3.2.2 Headphone Outputs
      3. 7.3.3 Digital Microphone Inteface
        1. 7.3.3.1 ADC Processing Blocks — Overview
          1. 7.3.3.1.1 Processing Blocks
      4. 7.3.4 DAC
        1. 7.3.4.1 DAC Processing Blocks — Overview
      5. 7.3.5 Powertune
      6. 7.3.6 Digital Audio I/O Interface
      7. 7.3.7 Clock Generation and PLL
      8. 7.3.8 Control Interfaces
        1. 7.3.8.1 I2C Control
        2. 7.3.8.2 SPI Control
    4. 7.4 Device Functional Modes
    5. 7.5 Register Maps
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics, Audio Outputs

At 25°C, AVdd, DVdd, IOVDD = 1.8V, LDO_in = 1.8V, AVdd LDO disabled, fs (Audio) = 48kHz, Cref = 10 μF on REF PIN, PLL disabled unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Audio DAC – Stereo Single-Ended Headphone Output
Device Setup Load = 16Ω (single-ended), 50pF
Headphone Output on AVdd Supply,
Input & Output CM = 0.9V, DOSR = 128,
MCLK = 256* fs, Channel Gain = 0dB
word length = 16 bits;
Processing Block = PRB_P1
Power Tune = PTM_P3
Full scale output voltage (0dB) 0.5 VRMS
SNR Signal-to-noise ratio, A-weighted(1)(2) All zeros fed to DAC input, modulator in excited state 88 100 dB
DR Dynamic range, A-weighted (1)(2) –60dB 1kHz input full-scale signal, Word Length = 20 bits, Power Tune = PTM_P4 99 dB
THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal –80 –70 dB
DAC Gain Error 0dB, 1kHz input full scale signal ±0.1 dB
DAC Mute Attenuation Mute 127 dB
DAC channel separation –1dB, 1kHz signal, between left and right HP out 92 dB
DAC PSRR 100mVpp, 1kHz signal applied to AVdd 70 dB
100mVpp, 217Hz signal applied to AVdd 75 dB
Power Delivered RL=16Ω, Output Stage on AVdd = 1.8V
THDN < 1%, Input CM=0.9V,
Output CM=0.9V, Channel Gain = 2dB
13 mW
RL= 16Ω Output Stage on LDOIN = 3.3V,
THDN < 1% Input CM = 0.9V,
Output CM = 1.65V, Channel Gain = 8dB
47
Audio DAC – Stereo Single-Ended Headphone Output
Device Setup Load = 16Ω (single-ended), 50pF,
Headphone Output on AVdd Supply,
Input and Output CM = 0.75V; AVdd = 1.5V,
DOSR = 128, MCLK = 256 x fs,
Channel Gain = –2dB, word length = 20-bits;
Processing Block = PRB_P1,
Power Tune = PTM_P4
Full scale output voltage (0dB) 0.375 VRMS
SNR Signal-to-noise ratio, A-weighted(1)(2) All zeros fed to DAC input, modulator in excited state 99 dB
DR Dynamic range, A-weighted (1)(2) -60dB 1 kHz input full-scale signal 98 dB
THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal –84 dB
Audio DAC – Mono Differential Headphone Output
Device Setup Load = 32 Ω (differential), 50pF,
Headphone Output on LDOIN Supply
Input CM = 0.75V, Output CM = 1.5V,
AVdd=1.8V, LDOIN = 3.0V, DOSR = 128
MCLK = 256* fs, Channel (headphone driver) Gain = 5dB for full scale output signal,
word length = 16-bits,
Processing Block = PRB_P1,
Power Tune = PTM_P3
Full scale output voltage (0dB) 1778 mVRMS
SNR Signal-to-noise ratio, A-weighted(1)(2) All zeros fed to DAC input, modulator in excited state 101 dB
DR Dynamic range, A-weighted (1)(2) –60dB 1kHz input full-scale signal 98 dB
THD Total Harmonic Distortion –3dB full-scale, 1-kHz input signal –82 dB
Power Delivered RL = 32Ω, Output Stage on LDOIN = 3.3V,
THDN < 1%, Input CM = 0.9V,
Output CM = 1.65V, Channel Gain = 8dB
125 mW
RL = 32Ω Output Stage on LDOIN = 3V,
THDN < 1% Input CM = 0.9V,
Output CM = 1.5V, Channel Gain = 8dB
103 mW
Ratio of output level with 1-kHz full-scale sine wave input, to the output level with the inputs short circuited, measured A-weighted over a 20-Hz to 20-kHz bandwidth using an audio analyzer.
All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values