ZHCSLH6D June   2021  – July 2022 TLV3601-Q1 , TLV3602-Q1 , TLV3603-Q1

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Push-Pull (Single-Ended) Output
      3. 7.4.3 Known Startup Condition
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Hysteresis
      2. 8.1.2 Capacitive Loads
      3. 8.1.3 Latch Functionality
    2. 8.2 Typical Application
      1. 8.2.1 Implementing Hysteresis
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Optical Receiver
      3. 8.2.3 Over-Current Latch Condition
      4. 8.2.4 External Trigger Function for Oscilloscopes
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC TLV3601 TLV3601 TLV3602 TLV3602 TLV3603 UNIT
DBV (SOT-23) DCK (SC70) DGK (VSSOP) DSG (WSON) DCK (SC70)
5 PINS 5 PINS 8 PINS 8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 176.5 187.5 170.5 64.9 165.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 74.7 139.2 61.7 83.9 129.1 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A N/A N/A 5.5 N/A °C/W
RθJB Junction-to-board thermal resistance 43.4 65.8 92.4 32.0 58.9 °C/W
ψJT Junction-to-top characterization parameter 16.7 43.0 8.9 2.1 39.4 °C/W
ψJB Junction-to-board characterization parameter 43.1 65.5 90.8 32.0 58.7 °C/W
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