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ZHCSFO7A November 2016 – May 2018 TLV170 , TLV2170 , TLV4170

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TLV4170		UNIT
		D (SOIC)	PW (TSSOP)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	93.2	106.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.8	24.4	°C/W
R_θJB	Junction-to-board thermal resistance	49.4	59.3	°C/W
ψ_JT	Junction-to-top characterization parameter	13.5	0.6	°C/W
ψ_JB	Junction-to-board characterization parameter	42.2	54.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.