ZHCSFN0C November 2016 – January 2019 TLV172 , TLV2172 , TLV4172
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2172 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 116.1 | 158 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 69.8 | 48.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.6 | 78.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 22.5 | 3.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 56.1 | 77.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |