SLVSAF0A August 2010 – May 2015 TLV61225
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Voltage(2) | VIN, L, VOUT, EN, FB | –0.3 | 7.5 | V |
Temperature | Operating junction temperature, TJ | –40 | 150 | °C |
Storage, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | 2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | 1500 | |||
Machine model (MM) | 200 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VIN | Supply voltage at VIN | 0.7 | 3.3 | V |
TA | Operating free air temperature | –40 | 85 | °C |
TJ | Operating virtual junction temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TLV61225 | UNIT | |
---|---|---|---|
DCK (SOT) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 231.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 55.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 77.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 76.4 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
DC-DC STAGE | |||||||
VIN | Input voltage range | 0.7 | 3.3 | V | |||
VIN | Maximum minimum input voltage for start-up | RLoad ≥ 150 Ω, TA = 25°C | 0.7 | V | |||
VOUT | TLV61225 output voltage | VIN < VOUT | 3.13 | 3.3 | 3.43 | V | |
ILH | Inductor current ripple | 200 | mA | ||||
ISW | switch current limit | VOUT = 3.3 V, VIN = 1.2 V | 160 | 400 | mA | ||
RDSon_HSD | Rectifying switch ON-resistance | VOUT = 3.3 V | 1000 | mΩ | |||
RDSon_LSD | Main switch ON-resistance | VOUT = 3.3 V | 600 | mΩ | |||
Line regulation | VIN < VOUT | 0.5% | |||||
Load regulation | VIN < VOUT | 0.5% | |||||
IQ | Quiescent current | VIN | IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.3 V |
0.5 | 1 | μA | |
VOUT | 5 | 10 | μA | ||||
ISD | Shutdown current | VIN | VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN | 0.2 | 1 | μA | |
ILKG_VOUT | Leakage current into VOUT | VEN = 0 V, VIN = 1.2 V, VOUT = 3.3 V | 1 | μA | |||
ILKG_L | Leakage current into L | VEN = 0 V, VIN = 1.2 V, VL = 1.2 V, VOUT ≥ VIN | 0.01 | 0.7 | μA | ||
IEN | EN input current | Clamped on GND or VIN (VIN < 1.5 V) | 0.005 | 0.1 | μA | ||
CONTROL STAGE | |||||||
VIL | Maximum EN input low voltage | VIN ≤ 1.5 V | 0.2 × VIN | V | |||
VIH | Minimum EN input high voltage | VIN ≤ 1.5 V | 0.8 × VIN | V | |||
VIL | Maximum EN input low voltage | VIN > 1.5 V | 0.4 | V | |||
VIH | Minimum EN input high voltage | VIN > 1.5 V | 1.2 | V | |||
VUVLO | Undervoltage lockout threshold for turnoff | VIN decreasing | 500 | mV | |||
Undervoltage lockout hysteresis | 50 | mV | |||||
Overvoltage protection threshold | 5.5 | 7.5 | V | ||||
Overtemperature protection | 140 | °C | |||||
Overtemperature hysteresis | 20 | °C |
PACKAGE | POWER RATING TA ≤ 25°C |
DERATING FACTOR ABOVE TA = 25°C |
---|---|---|
DCK | 444 mW | 4.44 mW/°C |
FIGURE | ||
---|---|---|
Minimum of Maximum Output Current | vs Input Voltage | Figure 1 |
Efficiency | vs Output Current, VIN = [1.2 V; 2.4 V; 3 V] | Figure 2 |
vs Input Voltage, IOUT = [100 uA; 1 mA; 10 mA; 50 mA] | Figure 3 | |
Input Current | vs Input Voltage at No Output Load, Device Enabled | Figure 4 |
Output Voltage | vs Output Current, VIN = [1.2 V; 2.4 V] | Figure 5 |
vs Input Voltage, Device Disabled, RLOAD = [1 kΩ; 10 kΩ] | Figure 6 |