ZHCS760H February 2012 – June 2018 TLV62130 , TLV62130A
PRODUCTION DATA.
| PIN(1) | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| AGND | 6 | — | Analog Ground. Must be connected directly to the Exposed Thermal Pad and common ground plane. |
| AVIN | 10 | I | Supply voltage for control circuitry. Connect to same source as PVIN. |
| DEF | 8 | I | Output Voltage Scaling (Low = nominal, High = nominal + 5%)(3) |
| EN | 13 | I | Enable input (High = enabled, Low = disabled)(3) |
| FB | 5 | I | Voltage feedback. Connect resistive voltage divider to this pin. |
| FSW | 7 | I | Switching Frequency Select (Low ≈ 2.5 MHz, High ≈ 1.25 MHz(2) for typical operation)(3) |
| PG | 4 | O | Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain (requires pull-up resistor) |
| PGND | 15, 16 | — | Power ground. Must be connected directly to the Exposed Thermal Pad and common ground plane. |
| PVIN | 11, 12 | I | Supply voltage for power stage. Connect to same source as AVIN. |
| SS/TR | 9 | I | Soft-Start / Tracking Pin. An external capacitor connected to this pin sets the internal voltage reference rise time. It can be used for tracking and sequencing. |
| SW | 1, 2, 3 | O | Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and output capacitor. |
| VOS | 14 | I | Output voltage sense pin and connection for the control loop circuitry. |
| Exposed Thermal Pad | — | — | Must be connected to AGND (pin 6), PGND (pin 15,16) and common ground plane. See Layout Example. Must be soldered to achieve appropriate power dissipation and mechanical reliability. |