ZHCSHH1B January   2018  – November 2019 TLV6700

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化方框图
      2.      输出响应
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Inputs (INA+, INB–)
      2. 8.3.2 Outputs (OUTA, OUTB)
      3. 8.3.3 Window Comparator
      4. 8.3.4 Immunity to Input Terminal Voltage Transients
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > UVLO)
      2. 8.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 8.4.3 Power-On Reset (VDD < V(POR))
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 VPULLUP to a Voltage Other Than VDD
      2. 9.1.2 Monitoring VDD
      3. 9.1.3 Monitoring a Voltage Other Than VDD
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Resistor Divider Selection
        2. 9.2.2.2 Pullup Resistor Selection
        3. 9.2.2.3 Input Supply Capacitor
        4. 9.2.2.4 Input Capacitors
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TLV6700 UNIT
DDC
(SOT)		 DSE
(WSON)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 204.6 194.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.5 128.9 °C/W
RθJB Junction-to-board thermal resistance 54.3 153.8 °C/W
ψJT Junction-to-top characterization parameter 0.8 11.9 °C/W
ψJB Junction-to-board characterization parameter 52.8 157.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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