SLVSA00E September 2009 – April 2015 TLV700
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
11.1.1.1 Evaluation Modules
Three evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the TLV700:
These EVMs can be requested at the Texas Instruments website through the product folders or purchased directly from the TI eStore.
11.1.1.2 Spice Models
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TLV700 is available through the product folders under Tools & Software.
11.1.2 Device Nomenclature
Table 3. Ordering Information(1)
| PRODUCT | VOUT(2) |
|---|---|
| TLV700xxyyyz | XX is nominal output voltage (for example, 28 = 2.8 V). YYY is the package designator. Z is tape and reel quantity (R = 3000, T = 250). |
11.2 Documentation Support
11.3 Trademarks
Bluetooth is a registered trademark of Bluetooth SIG.
All other trademarks are the property of their respective owners.
ZigBee is a registered trademark of the ZigBee Alliance.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.