ZHCS844D November   2011  – January 2025 TLV70012-Q1 , TLV70018-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Internal Current Limit
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Undervoltage Lockout (UVLO)
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown
      2. 6.4.2 Operation with VIN Less than 2V
      3. 6.4.3 Operation with VIN Greater than 2V
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Requirements
        2. 7.2.2.2 Transient Response
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
        2. 7.4.1.2 Power Dissipation
          1. 7.4.1.2.1 Thermal Calculations
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
      2. 8.1.2 Package Mounting
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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订购信息
Thermal Calculations

Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current and the voltage drop across the output pass transistor, as shown in Equation 1.

Equation 1. TLV70018-Q1 TLV70012-Q1

where

  • PD is continuous power dissipation
  • IOUT is output current
  • VIN is input voltage
  • VOUT is output voltage

Because IQ << IOUT, the term IQ × VIN is always ignored.

For a device under operation at a given ambient air temperature (TA), use Equation 2 to calculate the junction temperature (TJ).

Equation 2. TLV70018-Q1 TLV70012-Q1

where:

  • ZθJA is the junction-to-ambient air temperature thermal impedance

Use Equation 3 to calculate the rise in junction temperature due to power dissipation.

Equation 3. TLV70018-Q1 TLV70012-Q1

For a given maximum junction temperature (TJ(MAX), use Equation 4 to calculate the maximum ambient air temperature (TA(MAX) at which the device can operate.

Equation 4. TLV70018-Q1 TLV70012-Q1