ZHCSGV4H September   2017  – July 2021 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7032/42
    3.     Pin Functions: TLV7034/44
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (Single)
    5. 6.5  Thermal Information (Dual)
    6. 6.6  Thermal Information (Quad)
    7. 6.7  Electrical Characteristics (Single)
    8. 6.8  Switching Characteristics (Single)
    9. 6.9  Electrical Characteristics (Dual)
    10. 6.10 Switching Characteristics (Dual)
    11. 6.11 Electrical Characteristics (Quad)
    12. 6.12 Switching Characteristics (Quad)
    13. 6.13 Timing Diagrams
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV703x
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV703x
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
      4. 8.2.4 Quadrature Rotary Encoder
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Thermal Information (Quad)

THERMAL METRIC(1)TLV7034/44UNIT
RTE (QFN)PW (TSSOP)
16 PINS14 PINS
RθJAJunction-to-ambient thermal resistance

65.4

131.0

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

70.2

60.5

°C/W
RθJBJunction-to-board thermal resistance

40.5

74.1

°C/W
ΨJTJunction-to-top characterization parameter

5.6

12.6

°C/W
ΨJBJunction-to-board characterization parameter

40.5

73.5

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

24.1

n/a

°C/W
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