ZHCSGF2C July   2017  – June 2019 TLV743P

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路
      2.      压降电压与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown and Output Enable
      3. 7.3.3 Internal Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Capacitor Selection
      2. 8.1.2 Dropout Voltage
      3. 8.1.3 Power Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
      2. 11.1.2 器件命名规则
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DQN|4
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (March 2018) to C Revision

  • Changed description of EN pin in Pin Functions tableGo
  • Deleted typical specification from VEN(HI) and VEN(LO) parameters Go
  • Added maximum specification to ILIM parameter Go
  • Added condition to 1-V Load Regulation vs IOUT and Temperature figureGo
  • Added condition to 1.8-V Load Regulation vs IOUT and Temperature figureGo
  • Added condition to 3.3-V Load Regulation vs IOUT and Temperature figure Go
  • Added condition to 1.2-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added condition to 1.8-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added condition to 3.3-V Dropout Voltage vs IOUT and Temperature figure Go
  • Added and Output Enable to title and changed first paragraph of Shutdown and Output Enable sectionGo
  • Added DBV package to Maximum Ambient Temperature vs Device Power Dissipation figure and text referenceGo
  • Added 将 (3) 添加到器件命名规则 表Go

Changes from A Revision (January 2018) to B Revision

  • Changed 将 X2SON 封装从预览更改为生产数据（有效）Go

Changes from * Revision (July 2017) to A Revision

  • Added X2SON 封装至特性 列表Go
  • Added 将 DQN (X2SON) 封装添加至说明 部分Go
  • Added 将 X2SON 封装添加至器件信息 表Go
  • Added DQN (X2SON) package pinout drawing and pin functions table to Pin Configuration and Functions section Go
  • Deleted thermal pad from DBV pinout drawing and Pin Functions table Go
  • Changed format of I/O column contents and order of packages in Pin Functions table Go
  • Added DQN (X2SON) thermal information to Thermal Information table Go
  • Changed condition text for Figure 31Go
  • Added X2SON layout example image to Layout Examples section Go
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