ZHCSL29A April   2020  – December 2020 TLV767-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Recommended Capacitor Types
      3. 8.1.3 Input and Output Capacitor Requirements
      4. 8.1.4 Reverse Current
      5. 8.1.5 Feed-Forward Capacitor (CFF)
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Transient Response
        2. 8.2.2.2 Choose Feedback Resistors
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.5 V or 2.5 V (whichever is greater), IOUT = 10 mA, VEN = 2.0 V, CIN = 1.0 µF, and COUT = 1.0 µF (unless otherwise noted)

GUID-4D4F6B3D-85B8-4DCF-91DE-B893E8EEB8F0-low.gif
VIN = 3.0 V
Figure 6-1 VOUT Accuracy vs IOUT
GUID-398DCC5A-406C-4979-AECE-08DDE1CDED29-low.gif
IOUT = 10 mA
Figure 6-3 VOUT Accuracy vs VIN
GUID-0A6C7249-1878-4341-9C3F-6E951984135D-low.gif
IOUT = 0 mA, adjustable-voltage version devices
Figure 6-5 IQ vs VIN
GUID-AA4CBB6F-2C61-4A0C-9656-8FD189A2C27A-low.gif
VIN = 3.0 V
Figure 6-7 IGND vs IOUT
GUID-36F85C39-A200-48F8-AEB6-DA79AAACFB96-low.gif
IOUT = 0 mA
Figure 6-9 IQ Increase Below Minimum VIN
GUID-F08670A0-926E-4138-9617-345E47533F11-low.gif
VIN = 5 V, VOUT = 3.3 V, CFF = 10 pF, ramp rate = 0.5 A/µs
Figure 6-11 IOUT Transient From 1 mA to 1 A
GUID-63E9AF61-0BFA-41C0-9772-CF28E35F5D62-low.gif
VOUT = 3.3 V, IOUT = 1 A, VIN ramp rate = 0.6 V/µs
Figure 6-13 VIN Transient in Dropout From 4 V to 13 V
GUID-7450598B-0C54-49E6-9BFB-5F886E5DB027-low.gif
IOUT = 1.0 A
Figure 6-15 VDO vs VIN
GUID-AD0B9249-E3C8-4349-B6D1-8ADC55468ACF-low.gif
VIN = 3.0 V
Figure 6-17 VDO vs IOUT
GUID-A7C7CD2C-65E2-4127-BA7F-1F68093E71A7-low.gif
VIN = 3.0 V
Figure 6-19 Foldback Current Limit vs IOUT and Temperature
GUID-35933080-2ADE-431E-9359-CAAA36A3C5C8-low.gif
VOUT = 3.3 V
Figure 6-21 Startup With Separate VEN and VIN
GUID-588B237E-808C-4521-80EA-074A22BE598A-low.gif
VIN = 2.5 V
Figure 6-23 VEN Thresholds vs Temperature
GUID-3AD58EA3-AE3F-4F4F-832A-31BCA1A69799-low.gif
 
Figure 6-25 UVLO Thresholds vs Temperature
GUID-75326E52-8CB4-42B2-ABFB-09AE570F180D-low.gif
VOUT = 1.8 V, IOUT = 0.55 A, CFF = 1 nF
Figure 6-27 PSRR vs Frequency and VIN
GUID-F9250633-2C8A-40EA-96B9-3E4AEC8EA24C-low.gif
CFF = 0 nF, IOUT = 0.1 A, RMS noise BW = 10 Hz to 100 kHz
Figure 6-29 Output Noise (Vn) vs Frequency and VOUT
GUID-5BA4E58E-7E57-4AEB-8DCC-D555A1C937EA-low.gif
VOUT = 2.5 V
Figure 6-31 IPULLDOWN vs VIN
GUID-F101F37A-0FEA-4907-B335-9D9F7F96635E-low.gif
VOUT = 3.3 V, IOUT = 33 µA
Figure 6-33 Startup Inrush Current With COUT = 22 µF
GUID-5C9C68AF-F7D6-4BF1-B1C5-9DD99FAF7896-low.gif
VIN = 2.5 V
Figure 6-2 VOUT Accuracy vs IOUT
GUID-E42237CC-D553-4D41-B2E9-926DC548818C-low.gif
 
Figure 6-4 ISHUTDOWN vs VIN
GUID-8B83586A-C5F6-4852-B6D4-753AB76DCD88-low.gif
IOUT = 0 mA, fixed-voltage version devices
Figure 6-6 IQ vs Temperature
GUID-7507EE02-3506-4E45-B98F-9E66349369C1-low.gif
VIN = 2.5 V
Figure 6-8 IGND vs IOUT
GUID-4707F463-308D-4F91-9FBE-650D02B0D9B2-low.gif
VIN = 5 V, VOUT = 3.3 V, CFF = 10 pF, ramp rate = 0.4 A/µs
Figure 6-10 IOUT Transient From 0 mA to 100 mA
GUID-B8EB22C5-1E7C-4007-A0BD-82374C165DE8-low.gif
VIN = 5 V, VOUT = 3.3 V, ramp rate = 0.8 A/µs
Figure 6-12 IOUT Transient From 250 mA to 850 mA
GUID-0EE78D19-53E5-4378-BF43-E2445B2CA38E-low.gif
VOUT = 3.3 V, IOUT = 33 µA, VIN ramp rate = 1.6 V/µs
Figure 6-14 VIN Transient From 5 V to 16 V
GUID-057A78D7-0A9C-4FBF-9E4D-AE9D43D968C6-low.gif
IOUT = 0.8 A
Figure 6-16 VDO vs VIN
GUID-9AC04E09-5B8C-4A4E-B945-650C293DC65E-low.gif
VIN = 2.5 V
Figure 6-18 VDO vs IOUT
GUID-21686C6F-B377-4B5B-82D4-503645A0CFF2-low.gif
VIN = 2.5 V
Figure 6-20 Foldback Current Limit vs IOUT and Temperature
GUID-58E69E8B-B921-47DB-8C15-99864B2A65DA-low.gif
EN pulled up internally, VOUT = 0.8 V
Figure 6-22 Startup With VEN Floating
GUID-CAEDF736-B68A-41D5-B7F9-E7DEC8E6F61F-low.gif
VIN = 16 V
Figure 6-24 VEN Thresholds vs Temperature
GUID-5F064C67-9FE6-48DE-B07F-E679713BD59B-low.gif
VOUT = 1.8 V, VIN = 3.3 V, CFF = 1 nF
Figure 6-26 PSRR vs Frequency and IOUT
GUID-247FDDE7-267D-4B35-8746-32F5D5D374DA-low.gif
VOUT = 3.3 V, VIN = 4.8 V, IOUT = 0.33 A
Figure 6-28 PSRR vs Frequency and CFF
GUID-8B8D4F5C-835D-4124-85C5-8AC061D370A4-low.gif
VEN = 0 V
Figure 6-30 IEN vs VIN
GUID-D724D5C6-5726-4064-BCD1-428B41CC1D6C-low.gif
VFB = 1.0 V
Figure 6-32 IFB vs Temperature
GUID-61D2EBF0-BBAF-47BD-B040-FFF21A667E1D-low.gif
VOUT = 3.3 V, IOUT = 33 µA
Figure 6-34 Startup Inrush Current With COUT = 47 µF