ZHCSJ62D December 2017 – July 2021 TLV767
PRODUCTION DATA
| THERMAL METRIC(1) | TLV767 | UNIT | |||
|---|---|---|---|---|---|
| DBV (SOT23) | DGN (HVSSOP) | DRV (WSON) | |||
| 5 PINS | 8 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 165.7 | 60.1 | 77.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.6 | 81.7 | 92.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.9 | 32.8 | 40.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 11.6 | 6 | 4.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 37.6 | 32.7 | 40.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 15.5 | 18.9 | °C/W |