SNVSBY3A November   2020  – April 2021 TLV840-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (VDD)
        1. 8.3.1.1 VDD Hysteresis
        2. 8.3.1.2 VDD Transient Immunity
      2. 8.3.2 User-Programmable Reset Time Delay
      3. 8.3.3 Manual Reset (MR) Input
      4. 8.3.4 Output Logic
        1. 8.3.4.1 RESET Output, Active-Low
        2. 8.3.4.2 RESET Output, Active-High
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VPOR)
      2. 8.4.2 Below Power-On-Reset (VDD < VPOR)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design 1: Dual Rail Monitoring with Power-up Sequencing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Application Curve: Adjusting Output Reset Delay on TLV840EVM
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

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Detailed Design Procedure

The primary constraint for this application is choosing the correct device to monitor the supply voltage of the microprocessor. The TLV840-Q1 can monitor any voltage between 0.8 V and 5.4 V. Depending on how far away from the nominal voltage rail the user wants the voltage supervisor to trigger determines the correct voltage supervisor variant to choose. In this example, the first TLV840-Q1 triggers when the 3.3-V rail falls to 2.9 V. The second TLV840-Q1 triggers a reset when the 1.2-V rail falls to 0.9 V. The secondary constraint for this application is the reset time delay that must be at least 25 ms to allow the microprocessor, and all other devices using the 3.3-V rail, enough time to startup correctly before the 1.2-V rail is enabled via the LDO. Because a minimum time is required, the user must account for capacitor tolerance. For applications with ambient temperatures ranging from –40°C to +125°C, CCT can be calculated using RCT and solving for CCT in Equation 2. Solving Equation 2 for 25 ms gives a minimum capacitor value of 0.0403 µF which is rounded up to a standard value 0.047 µF to account for capacitor tolerance.

A 1 µF decoupling capacitor is connected to the VDD pin as a good analog design practice. The pull-up resistor is only required for the Open-Drain device variants and is calculated to ensure that VOL does not exceed max limit given the Isink possible at the expected supply voltage. In this design example nominal VDD is 1.2 V but dropping to 0.9 V. In Section 7.5, max VOL provides 15 µA I sink for 0.7 V VDD, which is the closest voltage to this design example. Using 15 µA of Isink and 300 mV max VOL, gives us 40 kΩ for the pull-up resistor. Any value higher than 40 kΩ would ensure that VOL will not exceed 300 mV max specification.