米6体育平台手机版

ZHCS187E april 2011 – december 2020 TLV803 , TLV853

PRODUCTION DATA

7.3 Thermal Information

THERMAL METRIC⁽¹⁾		TLV8x3	UNITS
		DBZ (SOT-23)
		3 PINS
R_θJA	Junction-to-ambient thermal resistance	328.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	135.4	°C/W
R_θJB	Junction-to-board thermal resistance	58.3	°C/W
ψ_JT	Junction-to-top characterization parameter	5.2	°C/W
ψ_JB	Junction-to-board characterization parameter	59.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.