ZHCSQY7 september   2022 TMAG5173-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Temperature Sensor
    7. 6.7  Magnetic Characteristics For A1
    8. 6.8  Magnetic Characteristics For A2
    9. 6.9  Magnetic Temp Compensation Characteristics
    10. 6.10 I2C Interface Timing
    11. 6.11 Power up Timing
    12. 6.12 Typical Characteristics
  8. 7 详细说明
    1. 7.1 概述
    2. 7.2 功能方框图
    3. 7.3 Feature Description
      1. 7.3.1 磁通量方向
      2. 7.3.2 Sensor Location
      3. 7.3.3 Interrupt Function
      4. 7.3.4 Device I2C Address
      5. 7.3.5 Magnetic Range Selection
      6. 7.3.6 Update Rate Settings
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby (Trigger) Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Wake-up and Sleep (W&S) Mode
      4. 7.4.4 Continuous Measure Mode
    5. 7.5 Programming
      1. 7.5.1 I2C 接口
        1. 7.5.1.1 SCL
        2. 7.5.1.2 SDA
        3. 7.5.1.3 I2C Read/Write
          1. 7.5.1.3.1 标准 I2C 写入
          2. 7.5.1.3.2 通用广播写入
          3. 7.5.1.3.3 Standard 3-Byte I2C Read
          4. 7.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
          5. 7.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
          6. 7.5.1.3.6 I2C Read CRC
      2. 7.5.2 数据定义
        1. 7.5.2.1 磁传感器数据
        2. 7.5.2.2 Temperature Sensor Data
        3. 7.5.2.3 Angle and Magnitude Data Definition
        4. 7.5.2.4 Magnetic Sensor Offset Correction
    6. 7.6 TMAG5173 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Select the Sensitivity Option
      2. 8.1.2 Temperature Compensation for Magnets
      3. 8.1.3 Sensor Conversion
        1. 8.1.3.1 Continuous Conversion
        2. 8.1.3.2 Trigger Conversion
        3. 8.1.3.3 Pseudo-Simultaneous Sampling
      4. 8.1.4 Magnetic Limit Check
      5. 8.1.5 Error Calculation During Linear Measurement
      6. 8.1.6 Error Calculation During Angular Measurement
    2. 8.2 Typical Applications
      1. 8.2.1 I2C Address Expansion
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Angle Measurement
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Gain Adjustment for Angle Measurement
        3. 8.2.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 文档支持
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 商标
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10机械、封装和可订购信息
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Package Option Addendum

Packaging Information

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish(6) MSL Peak Temp(3) Op Temp (°C) Device Marking(4)(5)
PTMAG5173A1QDBVRQ1 ACTIVE SOT-23 DBV 6 3000 Call TI Call TI Call TI -40 to 125
PTMAG5173A2QDBVRQ1 ACTIVE SOT-23 DBV 6 3000 Call TI Call TI Call TI -40 to 125
PTMAG5173B1QDBVRQ1 PREVIEW SOT-23 DBV 6 Call TI Call TI Call TI Call TI Call TI
PTMAG5173B2QDBVRQ1 PREVIEW SOT-23 DBV 6 Call TI Call TI Call TI Call TI Call TI
PTMAG5173C1QDBVRQ1 PREVIEW SOT-23 DBV 6 Call TI Call TI Call TI Call TI Call TI
PTMAG5173C2QDBVRQ1 PREVIEW SOT-23 DBV 6 Call TI Call TI Call TI Call TI Call TI
PTMAG5173D1QDBVRQ1 PREVIEW SOT-23 DBV 6 Call TI Call TI Call TI Call TI Call TI
PTMAG5173D2QDBVRQ1 PREVIEW SOT-23 DBV 6 Call TI Call TI Call TI Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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