ZHCSQY7 september   2022 TMAG5173-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Temperature Sensor
    7. 6.7  Magnetic Characteristics For A1
    8. 6.8  Magnetic Characteristics For A2
    9. 6.9  Magnetic Temp Compensation Characteristics
    10. 6.10 I2C Interface Timing
    11. 6.11 Power up Timing
    12. 6.12 Typical Characteristics
  8. 7 详细说明
    1. 7.1 概述
    2. 7.2 功能方框图
    3. 7.3 Feature Description
      1. 7.3.1 磁通量方向
      2. 7.3.2 Sensor Location
      3. 7.3.3 Interrupt Function
      4. 7.3.4 Device I2C Address
      5. 7.3.5 Magnetic Range Selection
      6. 7.3.6 Update Rate Settings
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby (Trigger) Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Wake-up and Sleep (W&S) Mode
      4. 7.4.4 Continuous Measure Mode
    5. 7.5 Programming
      1. 7.5.1 I2C 接口
        1. 7.5.1.1 SCL
        2. 7.5.1.2 SDA
        3. 7.5.1.3 I2C Read/Write
          1. 7.5.1.3.1 标准 I2C 写入
          2. 7.5.1.3.2 通用广播写入
          3. 7.5.1.3.3 Standard 3-Byte I2C Read
          4. 7.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
          5. 7.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
          6. 7.5.1.3.6 I2C Read CRC
      2. 7.5.2 数据定义
        1. 7.5.2.1 磁传感器数据
        2. 7.5.2.2 Temperature Sensor Data
        3. 7.5.2.3 Angle and Magnitude Data Definition
        4. 7.5.2.4 Magnetic Sensor Offset Correction
    6. 7.6 TMAG5173 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Select the Sensitivity Option
      2. 8.1.2 Temperature Compensation for Magnets
      3. 8.1.3 Sensor Conversion
        1. 8.1.3.1 Continuous Conversion
        2. 8.1.3.2 Trigger Conversion
        3. 8.1.3.3 Pseudo-Simultaneous Sampling
      4. 8.1.4 Magnetic Limit Check
      5. 8.1.5 Error Calculation During Linear Measurement
      6. 8.1.6 Error Calculation During Angular Measurement
    2. 8.2 Typical Applications
      1. 8.2.1 I2C Address Expansion
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Angle Measurement
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Gain Adjustment for Angle Measurement
        3. 8.2.2.3 Application Curves
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 文档支持
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 商标
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10机械、封装和可订购信息
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) TMAG5173-Q1 UNIT
DBV (6-SOT23)
6 pins
RθJA Junction-to-ambient thermal resistance 162 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 81.6 °C/W
RθJB Junction-to-board thermal resistance 50.1 °C/W
ΨJT Junction-to-top characterization parameter 30.7 °C/W
ΨJB Junction-to-board characterization parameter 49.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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