ZHCSIX4I August   2007  – June 2024 TMP102

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Digital Temperature Output
      2. 6.3.2  Serial Interface
      3. 6.3.3  Bus Overview
      4. 6.3.4  Serial Bus Address
      5. 6.3.5  Writing and Reading Operation
      6. 6.3.6  Target Mode Operations
        1. 6.3.6.1 Target Receiver Mode
        2. 6.3.6.2 Target Transmitter Mode
      7. 6.3.7  SMBus Alert Function
      8. 6.3.8  General Call
      9. 6.3.9  High-Speed (HS) Mode
      10. 6.3.10 Timeout Function
      11. 6.3.11 Timing Diagrams
    4. 6.4 Device Functional Modes
      1. 6.4.1 Continuous-Conversion Mode
      2. 6.4.2 Extended Mode (EM)
      3. 6.4.3 Shutdown Mode (SD)
      4. 6.4.4 One-Shot/Conversion Ready (OS)
      5. 6.4.5 Thermostat Mode (TM)
        1. 6.4.5.1 Comparator Mode (TM = 0)
        2. 6.4.5.2 Interrupt Mode (TM = 1)
    5. 6.5 Programming
      1. 6.5.1 Pointer Register
      2. 6.5.2 Temperature Register
      3. 6.5.3 Configuration Register
        1. 6.5.3.1 Shutdown Mode (SD)
        2. 6.5.3.2 Thermostat Mode (TM)
        3. 6.5.3.3 Polarity (POL)
        4. 6.5.3.4 Fault Queue (F1/F0)
        5. 6.5.3.5 Converter Resolution (R1/R0)
        6. 6.5.3.6 One-Shot (OS)
        7. 6.5.3.7 EM Bit
        8. 6.5.3.8 Alert (AL Bit)
        9. 6.5.3.9 Conversion Rate (CR)
      4. 6.5.4 High- and Low-Limit Registers
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • SOT563 封装 (1.6mm × 1.6mm) 尺寸较 SOT-23 减小 68%
  • 精度无需校准:
    • -25°C 至 85°C 范围内为 2.0°C(最大值)
    • -40°C 至 125°C 范围内为 3.0°C(最大值)
  • 低静态电流:
    • 工作时 7.5μA(最大值)
    • 关断时 0.35μA(最大值)
  • 电源电压范围:1.4V 至 3.6V
  • 分辨率:12 位
  • 数字输出:与 SMBus、两线制和 I2C 接口兼容
  • NIST 可追溯