ZHCSHX1E March   2018  – August 2021 TMP1075

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics:TMP1075
    6. 8.6  Electrical Characteristics: TMP1075N
    7. 8.7  Timing Requirements:TMP1075
    8. 8.8  Timing Requirements: TMP1075N
    9. 8.9  Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital Temperature Output
      2. 9.3.2 I2C and SMBus Serial Interface
        1. 9.3.2.1  Bus Overview
        2. 9.3.2.2  Serial Bus Address
        3. 9.3.2.3  Pointer Register
          1. 9.3.2.3.1 Pointer Register Byte [reset = 00h]
        4. 9.3.2.4  Writing and Reading to the TMP1075
        5. 9.3.2.5  Operation Mode
          1. 9.3.2.5.1 Receiver Mode
          2. 9.3.2.5.2 Transmitter Mode
        6. 9.3.2.6  SMBus Alert Function
        7. 9.3.2.7  General Call- Reset Function
        8. 9.3.2.8  High-Speed Mode (HS)
        9. 9.3.2.9  Coexists in I3C Mixed Fast Mode
        10. 9.3.2.10 Time-Out Function
      3. 9.3.3 Timing Diagrams
      4. 9.3.4 Two-Wire Timing Diagrams
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Mode (OS)
      3. 9.4.3 Continuous Conversion Mode (CC)
      4. 9.4.4 Thermostat Mode (TM)
        1. 9.4.4.1 Comparator Mode (TM = 0)
        2. 9.4.4.2 Interrupt Mode (TM = 1)
        3. 9.4.4.3 Polarity Mode (POL)
    5. 9.5 Register Map
      1. 9.5.1 Register Descriptions
        1. 9.5.1.1 Temperature Register (address = 00h) [default reset = 0000h]
        2. 9.5.1.2 Configuration Register (address = 01h) [default reset = 00FFh (60A0h TMP1075N)]
        3. 9.5.1.3 Low Limit Register (address = 02h) [default reset = 4B00h]
        4. 9.5.1.4 High Limit Register (address = 03h) [default reset = 5000h]
        5. 9.5.1.5 Device ID Register (address = 0Fh) [default reset = 7500]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Migrating From the xx75 Device Family
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 接收文档更新通知
    2. 13.2 支持资源
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 Thermal Information

THERMAL METRIC(1) TMP1075 TMP1075 TMP1075 TMP1075N UNIT
DGK (VSSOP) D (SOIC) DSG (WSON) DRL (SOT)
8 PINS 8 PINS 8 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 202.5 130.4 87.4 210.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 82 76.9 111.1 105.0 °C/W
RθJB Junction-to-board thermal resistance 124.4 72.3 54 87.5 °C/W
ΨJT Junction-to-top characterization parameter 17.9 32 9.8 6.1 °C/W
ΨJB Junction-to-board characterization parameter 122.6 71.9 54.4 87.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance __ __ 28.1 __ °C/W
MT Thermal mass 16.6 64.2 5.0 __ mJ/°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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