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ZHCSH80E September 2017 – May 2019 TMP235 , TMP236

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

DCK|5
- MPDS025I
DBZ|3
- MPDS108G

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.4 Thermal Information

THERMAL METRIC ⁽¹⁾⁽²⁾		TMP235		UNIT
		DCK (SC70)	DBZ (SOT-23)
		PINS	PINS
R_θJA	Junction-to-ambient thermal resistance⁽³⁾⁽⁴⁾	275	167	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	84	90	°C/W
R_θJB	Junction-to-board thermal resistance	56	146	°C/W
Ψ_JT	Junction-to-top characterization parameter	1.2	35	°C/W
Ψ_JB	Junction-to-board characterization parameter	55	146	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) For information on self-heating and thermal response time seeLayout Guidelinessection.

(3) The junction to ambient thermal resistance (Rθ_JA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.

(4) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.