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ZHCSCZ4C October 2014 – September 2018 TMP302-Q1

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TMP302-Q1	UNIT
		DRL (SOT563)
		6 PINS
R_θJA	Junction-to-ambient thermal resistance	210.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	105.0	°C/W
R_θJB	Junction-to-board thermal resistance	87.5	°C/W
ψ_JT	Junction-to-top characterization parameter	6.1	°C/W
ψ_JB	Junction-to-board characterization parameter	87.0	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).