ZHCSKD0I September   2009  – October 2019 TMP431 , TMP432

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用电路原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Beta Compensation
      3. 8.3.3 Series Resistance Cancellation
      4. 8.3.4 Differential Input Capacitance
      5. 8.3.5 Filtering
      6. 8.3.6 Sensor Fault
      7. 8.3.7 THERM and ALERT/THERM2
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
      2. 8.4.2 One-Shot Mode
    5. 8.5 Programming
      1. 8.5.1  Serial Interface
      2. 8.5.2  Bus Overview
      3. 8.5.3  Timing Diagrams
      4. 8.5.4  Serial Bus Address
      5. 8.5.5  Read and Write Operations
      6. 8.5.6  Undervoltage Lockout
      7. 8.5.7  Timeout Function
      8. 8.5.8  High-Speed Mode
      9. 8.5.9  General Call Reset
      10. 8.5.10 SMBus Alert Function
    6. 8.6 Register Maps
      1. 8.6.1  Pointer Register
      2. 8.6.2  Temperature Registers
      3. 8.6.3  Limit Registers
      4. 8.6.4  Status Registers
        1. 8.6.4.1 TMP431 Status Register
        2. 8.6.4.2 TMP432 Status Register
      5. 8.6.5  Configuration Register 1
      6. 8.6.6  Configuration Register 2
      7. 8.6.7  Conversion Rate Register
      8. 8.6.8  Beta Compensation Configuration Register
      9. 8.6.9  η-Factor Correction Register
      10. 8.6.10 Software Reset
      11. 8.6.11 Consecutive Alert Register
      12. 8.6.12 Therm Hysteresis Register
      13. 8.6.13 Identification Registers
      14. 8.6.14 Open Status Register
      15. 8.6.15 Channel Mask Register
      16. 8.6.16 High Limit Status Register
      17. 8.6.17 Low Limit Status Register
      18. 8.6.18 THERM Limit Status Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 相关链接
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Timing Requirements(1)

FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency V+ 0.001 0.4 0.001 2.5 MHz
t(BUF) Bus free time between STOP and START condition 600 160 ns
t(HDSTA) Hold time after repeated START condition.
After this period, the first clock is generated.
100 100 ns
t(SUSTA) Repeated START condition setup time 100 100 ns
t(SUSTO) STOP condition setup time 100 100 ns
t(HDDAT) Data hold time 0(2) 900 0(3) 80 ns
t(SUDAT) Data setup time 100 25 ns
t(LOW) SCL clock LOW period V+ 1300 265 ns
t(HIGH) SCL clock HIGH period 600 60 ns
tFD Data fall time 300 160 ns
tRC Clock rise time 300 40 ns
SCLK ≤ 100 kHz 1000
tFC Clock fall time 300 40 ns
Values based on a statistical analysis of a one-time sample of devices. Minimum and maximum values are not specified and not production tested.
For cases with a fall time of SCL less than 20 ns or where the rise time or fall time of SDA is less than 20 ns, the hold time must be greater than 20 ns.
For cases with a fall time of SCL less than 10 ns or where the rise or fall time of SDA is less than 10 ns, the hold time must be greater than 10 ns.